Optoelectronic component and method for producing same
US-12176444-B2 · Dec 24, 2024 · US
US9155192B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9155192-B2 |
| Application number | US-201314051019-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 10, 2013 |
| Priority date | Nov 29, 2012 |
| Publication date | Oct 6, 2015 |
| Grant date | Oct 6, 2015 |
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Official abstract text for this publication.
Disclosed herein is an electronic component package including: a connection member provided on at least one surface of a substrate; an active element coupled to the substrate by the connection member; a molding part covering an exposed surface of the active element; and an additional layer formed on an exposed surface of the molding part to decrease a warpage phenomenon. In the electronic component package, the warpage phenomenon may be decreased as compared with the related art.
Opening claim text (preview).
What is claimed is: 1. An electronic component package comprising: a connection member provided on at least one surface of a substrate; an active element coupled to the substrate by the connection member; a molding part covering an exposed surface of the active element; and an additional layer formed on an exposed surface of the molding part to decrease a warpage phenomenon, the electronic component package having a warpage value of 0 or less, and the additional layer be…
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