Electronic component package

US9155192B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9155192-B2
Application numberUS-201314051019-A
CountryUS
Kind codeB2
Filing dateOct 10, 2013
Priority dateNov 29, 2012
Publication dateOct 6, 2015
Grant dateOct 6, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Disclosed herein is an electronic component package including: a connection member provided on at least one surface of a substrate; an active element coupled to the substrate by the connection member; a molding part covering an exposed surface of the active element; and an additional layer formed on an exposed surface of the molding part to decrease a warpage phenomenon. In the electronic component package, the warpage phenomenon may be decreased as compared with the related art.

First claim

Opening claim text (preview).

What is claimed is: 1. An electronic component package comprising: a connection member provided on at least one surface of a substrate; an active element coupled to the substrate by the connection member; a molding part covering an exposed surface of the active element; and an additional layer formed on an exposed surface of the molding part to decrease a warpage phenomenon, the electronic component package having a warpage value of 0 or less, and the additional layer be…

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Frequently asked questions

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What does patent US9155192B2 cover?
Disclosed herein is an electronic component package including: a connection member provided on at least one surface of a substrate; an active element coupled to the substrate by the connection member; a molding part covering an exposed surface of the active element; and an additional layer formed on an exposed surface of the molding part to decrease a warpage phenomenon. In the electronic compo…
Who is the assignee on this patent?
Samsung Electro Mech
What technology area does this patent fall under?
Primary CPC classification H10W74/00. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 06 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).