Method of laser irradiation, laser irradiation apparatus, and method of manufacturing a semiconductor device
US-2017212354-A1 · Jul 27, 2017 · US
US9302346B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9302346-B2 |
| Application number | US-201013257059-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 19, 2010 |
| Priority date | Mar 20, 2009 |
| Publication date | Apr 5, 2016 |
| Grant date | Apr 5, 2016 |
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Method and apparatus for laser scoring a sheet material. An elongated laser beam having S-mode intensity profile in the width direction and a flat-top-mode profile in the length direction is used to achieve high precision scoring. The invention can be used for scoring large-size glass substrates for LCD displays.
Opening claim text (preview).
What is claimed is: 1. A process for splitting a sheet, comprising the following steps: (I-1) providing a circular laser beam having a diameter D(CLB) and an energy distribution in S-mode along any diameter thereof; (I-2) converting the circular laser beam into an elongated laser beam having a width W(LB) and a length L(LB) where intercepted by a surface of the sheet by passing the circular laser beam through an optical assembly adapted for maintaining the energy distribution in S-mode along the width, and transforming the energy distribution in S-mode to a flat-top-mode profile along the length; (II) exposing part of the surface of the sheet along a scoreline to the laser beam and causing the temperature of the exposed area to rise, wherein the total exposed area has a width W(EA), a length L(EA), W(EA)≈W(LB), and the scoreline is within the exposed area and is essentially parallel to L(LB); and (III) splitting the sheet substantially linearly along the scoreline, wherein the laser beam is generated by a continuous wave CO 2 laser. 2. A process according to claim 1 , wherein step (II) comprises the following steps: (II-1) translating the laser beam in a direction essentially parallel to L(LB) along a scoreline in the exposed area on the surface of the sheet. 3. A process according to claim 2 , wherein in step (II-1), the translation speed of the laser beam is at least 750 mm/s. 4. A process according to claim 1 , wherein in step (I), the laser beam provided has an aspect ratio of at least 30. 5. A process according to claim 1 , wherein in step (I), the laser beam provided has a width in the range of from 0.5 mm to 3 mm. 6. process according to claim 1 , wherein the sheet consists essentially of an inorganic glass material, glass-ceramic material or ceramic material. 7. A process according to claim 6 , wherein in step (III), the edge of the split glass sheets along the scoreline has a total waviness of not more than 50 μm. 8. A process according to claim 6 , wherein L(EA)≧2000 mm. 9. A process according to claim 1 , further comprising the following step (IIa) between step (II) and step (III): (IIa) cooling at least part of the exposed area by a fluid immediately upon exposure. 10. A process according to claim 9 , further comprising the following step (IIb) between step (II) and step (III): (IIb) bending the glass sheet along the scoreline. 11. A process according to claim 1 , wherein in step (I-2), the optical assembly is chosen such that W(LB)<D(CLB). 12. A process according to claim 1 , wherein in step (I-2), the optical assembly comprises a first lens operating to (a) elongate the dimension of the beam in the direction of L(LB) and (b) transform the energy distribution profile from S-mode to flat-top-mode in the direction of L(LB), and a second lens operating to decrease the dimension of the circular laser beam in the direction of W(LB). 13. A process according to claim 12 , wherein in step (I-2), the first lens is a diverging modified cylindrical lens, and the second lens is a focusing cylindrical lens. 14. A process according to claim 1 , wherein in step (I-2), the optical assembly comprises a single lens operating to (i) decrease the dimension of the circular laser beam in the direction of W(LB), and (ii) increase the dimension of and transform the energy distribution from S-mode to flat-top-mode the circular laser beam in the direction of L(LB).
Operations & Transport · mapped topic
for making a groove or trench, e.g. for scribing a break initiation groove · CPC title
for deburring or mechanical trimming (B23K26/351 takes precedence) · CPC title
Cooling arrangements (by using a fluid stream B23K26/14) · CPC title
Devices involving movement of the laser head in at least one axial direction · CPC title
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