Laser annealing device including tunable mask and method of using the same

Patent metadata

Field	Value
Publication number	US-9406515-B2
Application number	US-201514944047-A
Country	US
Kind code	B2
Filing date	Nov 17, 2015
Priority date	Dec 12, 2012
Publication date	Aug 2, 2016
Grant date	Aug 2, 2016

Abstract

A laser annealing device for compensating wafer heat maps and its method are disclosed. A laser annealing device comprises a pump laser source array including of a plurality of pump laser sources for irradiating a tunable mask, each pump laser source emitting pump laser, an annealing laser source for emitting annealing laser and irradiating the tunable mask, and a tunable mask for transmitting at least part of the annealing laser after being irradiated by the pump laser.

First claim

What is claimed is:

1. A method of performing laser annealing on a wafer, comprising:
irradiating a tunable mask with pump lasers emitted from pump laser sources, the pump laser sources forming a pump laser source array;
irradiating the tunable mask with an annealing laser emitted from an annealing laser source,
wherein the tunable mask becomes transmissive to at least part of the annealing laser after being irradiated by the pump lasers,
wherein the tunable mask has a band gap Eg, the annealing laser has an optical band gap Eb larger than the band gap Eg, and the pump lasers has an optical band gap Ea larger than the optical band gap Eb, and
wherein the tunable mask is substantially opaque to the annealing laser when it is not irradiated by the pump lasers.

2. The method according to claim 1 , wherein
the Ea is equal to or larger than 1.5 times of the Eg; and
the Eb is 80˜100 meV larger than the Eg.

3. The method according to claim 1 ,
wherein the emitting power of each of the pump laser sources in the pump laser source array is adjusted according to an expected transmittance profile of the tunable mask, and
wherein the expected transmittance profile is calculated using a pre-measured heat map of a wafer to be annealed, the Eg, and the Eb.

4. The method according to claim 1 , wherein:
the tunable mask is rotated around its rotating axis at a predetermined speed;
the pump laser sources in the pump laser source array are arranged in a first radial direction relative to the rotating axis;
the annealing laser source is arranged in a second radial direction relative to the rotating axis, the second radial direction forms a predetermined angle with the pump laser source array; and
the pump laser source array and the annealing laser source are fixed to the rotating axis, the pump laser source array and the annealing laser source being spaced apart a predetermined distance from the tunable mask along the rotating axis.

5. The method according to claim 4 , wherein the predetermined speed and the predetermined angle are adjustable so that the emitting power of each of the pump laser sources in the pump laser source array is calculated using
a pre-measured heat map of a wafer to be annealed,
the Eg, the Eb,
the predetermined speed, the predetermined angle, and the Ea.

6. The method according to claim 1 , wherein the tunable mask is made of Si, and the annealing laser has a wavelength of 600 nm.

7. The method according to claim 1 , wherein the annealing laser transmitted through the tunable mask passes through a slit for annealing.

8. The method according to claim 1 , further comprising before the irradiating the tunable mask with the pump lasers and the annealing laser, expanding the pump lasers and the annealing laser to be a spot having a desired size.

Assignees

• Semiconductor Mfg Int Shanghai Corp

Inventors

• Cai Boxiu

Classifications

• H10P14/381

  Beam shaping, e.g. using a mask · CPC title

• H10P95/90

  Thermal treatments, e.g. annealing or sintering · CPC title

• H10P34/40

  with high-energy radiation · CPC title

• H10P34/00

  Irradiation with electromagnetic or particle radiation of wafers, substrates or parts of devices · CPC title

• H10P34/42 Primary

  with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20) · CPC title