Plasma pre-clean module and process

Patent metadata

Field	Value
Publication number	US-9299557-B2
Application number	US-201414220001-A
Country	US
Kind code	B2
Filing date	Mar 19, 2014
Priority date	Mar 19, 2014
Publication date	Mar 29, 2016
Grant date	Mar 29, 2016

Abstract

A method for integrated circuit fabrication can include removing silicon oxide by a pre-clean process. The pre-clean process can include depositing a halogen-containing material on the surface of a substrate in a first reaction chamber, and transferring the substrate having the halogen-containing material to a second reaction chamber. Silicon oxide material can be removed from a surface of the substrate by sublimating the halogen-containing material in the second reaction chamber. A target material, such as a conductive material, may subsequently be deposited on the substrate surface in the second reaction chamber.

First claim

What is claimed is:

1. A method for integrated circuit fabrication, the method comprising:
removing a silicon oxide material from a surface of a substrate, wherein removing the silicon oxide material comprises:
depositing a halogen-containing material on the surface of the substrate in a first reaction chamber;
transferring the substrate having the halogen-containing material to a second reaction chamber; and
sublimating the halogen-containing material in the second reaction chamber, wherein sublimating the halogen-containing material comprises exposing the halogen-containing material to a plasma generated by a remote plasma unit; and

subsequently depositing a conductive material on the surface of the substrate in the second reaction chamber.

2. The method of claim 1 , wherein sublimating the halogen-containing material comprises heating the surface of the substrate to a temperature of about 80° C. or greater.

3. The method of claim 1 , wherein depositing the halogen-containing material comprises introducing into the first reaction chamber:
a carrier gas activated by the remote plasma unit; and
a halogen-containing gas.

4. The method of claim 3 , wherein the carrier gas comprises an inert gas.

5. The method of claim 4 , wherein the inert gas comprises argon.

6. The method of claim 3 , further comprising activating the halogen-containing gas by flowing the halogen-containing gas through the remote plasma unit.

7. The method of claim 6 , wherein depositing the halogen-containing material further comprises subsequently introducing into the first reaction chamber a halogen-containing gas unactivated by a plasma unit and a hydrogen-containing gas unactivated by a plasma unit.

8. The method of claim 7 , further comprising removing the activated halogen-containing gas from the first reaction chamber prior to introducing into the first reaction chamber the unactivated halogen-containing gas and the unactivated hydrogen-containing gas.

9. The method of claim 6 , wherein depositing the halogen-containing material further comprises subsequently introducing into the first reaction chamber a halogen-containing gas unactivated by a plasma unit followed by a hydrogen-containing gas unactivated by a plasma unit.

10. The method of claim 9 , further comprising removing the activated halogen-containing gas from the first reaction chamber prior to introducing into the first reaction chamber the unactivated halogen-containing gas, and removing the unactivated halogen-containing gas from the first reaction chamber prior to introducing the unactivated hydrogen-containing gas.

11. The method of claim 3 , wherein the halogen-containing gas comprises a fluorine-containing gas.

12. The method of claim 11 , wherein the fluorine-containing gas comprises nitrogen trifluoride.

13. The method of claim 11 , wherein the fluorine-containing gas comprises at least one of hydrogen fluoride and diatomic fluorine.

14. The method of claim 3 , wherein depositing the halogen-containing material further comprises introducing a hydrogen-containing gas into the first reaction chamber.

15. The method of claim 14 , further comprising activating at least one of the hydrogen-containing gas and the halogen-containing gas by flowing at least one of the hydrogen-containing gas and the halogen-containing gas through the remote plasma unit.

16. The method of claim 14 , wherein the hydrogen-containing gas comprises ammonia.

17. The method of claim 14 , wherein introducing the hydrogen-containing gas into the first reaction chamber comprises:
flowing the hydrogen-containing gas through a transfer tube between a remote plasma unit and the first reaction chamber; and
heating at least a portion of the transfer tube to a temperature of about 30° C. to about 120° C.

18. The method of claim 17 , further comprising introducing into the first reaction chamber the hydrogen-containing gas and the halogen-containing gas at a molar ratio of about 3:1 to about 10:1.

19. The method of claim 1 , wherein the halogen-containing material comprises ammonium hexafluorosilicate ((NH 4 ) 2 SiF 6 ).

20. The method of claim 1 , wherein sublimating the halogen-containing material comprises exposing the halogen-containing material to a heated gas, wherein the heated gas is heated to a temperature of greater than about 150° C.

21. The method of claim 1 , further comprising maintaining the substrate at a temperature of about 21° C. to about 28° C. during depositing the halogen-containing material.

22. The method of claim 1 , wherein the second reaction chamber comprises an epitaxial deposition chamber and wherein depositing the conductive material comprises performing an epitaxial deposition of silicon.

23. A method for integrated circuit fabrication, the method comprising:
removing a silicon oxide material from a surface of a substrate, wherein removing the silicon oxide material comprises:
depositing a halogen-containing material on the surface of the substrate in a first reaction chamber;
transferrin the substrate having the halogen-containing material to a second reaction chamber; and

sublimating the halogen-containing material in the second reaction chamber, wherein sublimating the halogen-containing material comprises heating the surface of the substrate to a temperature of about 80° C. to about 100° C.; and
subsequently depositing a conductive material on the surface of the substrate in the second reaction chamber.

24. A method for integrated circuit fabrication, the method comprising:
removing a silicon oxide material from a surface of a substrate, wherein removing the silicon oxide material comprises:
depositing a halogen-containing material on the surface of the substrate in a first reaction chamber;
transferrin the substrate having the halogen-containing material to a second reaction chamber; and

sublimating the halogen-containing material in the second reaction chamber,
wherein the surface of the substrate further comprises silicon nitride, and wherein removing the silicon oxide material comprises selectively removing the silicon oxide material relative to the silicon nitride at a selectivity of about 7:1 to about 60:1; and
subsequently depositing a conductive material on the surface of the substrate in the second reaction chamber.

25. A method for integrated circuit fabrication, the method comprising:
removing a silicon oxide material from a surface of a substrate, wherein removing the silicon oxide material comprises:
depositing a halogen-containing material on the surface of the substrate in a first reaction chamber;
transferring the substrate having the halogen-containing material to a second reaction chamber; and

sublimating the halogen-containing material in the second reaction chamber, wherein sublimating the halogen-containing material comprises exposing the halogen-containing material to ultra-violet radiation; and
subsequently depositing a conductive material on the surface of the substrate in the second reaction chamber.

26. A method for integrated circuit fabrication, the method comprising:
removing a silicon oxide material from a surface of a substrate, wherein removing the silicon oxide material comprises:
depositing a first halogen-containing material on the surface of the substrate in a first reaction chamber;
sublimating the first halogen-containing material in the first reaction chamber to remove a first portion o

Assignees

• Asm Ip Holding Bv

Inventors

• Tolle John
• Goodman Matthew G
• Vyne Robert Michael
• Hill Eric R

Classifications

• H10P95/90

  Thermal treatments, e.g. annealing or sintering · CPC title

• H10P70/27

  during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers · CPC title

• H10P70/12 Primary

  by dry cleaning only (H10P70/52 takes precedence) · CPC title

• H10P50/283

  by chemical means · CPC title

• H10P14/69433

  the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz · CPC title