Pattern forming method, resist composition for multiple development used in the pattern forming method, developer for negative development used in the pattern forming method, and rinsing solution for negative development used in the pattern forming method

US9291904B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9291904-B2
Application numberUS-201414549164-A
CountryUS
Kind codeB2
Filing dateNov 20, 2014
Priority dateDec 25, 2006
Publication dateMar 22, 2016
Grant dateMar 22, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A pattern forming method, including: (A) coating a substrate with a positive resist composition of which solubility in a positive developer increases and solubility in a negative developer decreases upon irradiation with actinic rays or radiation, so as to form a resist film; (B) exposing the resist film; and (D) developing the resist film with a negative developer; a positive resist composition for multiple development used in the method; a developer for use in the method; and a rinsing solution for negative development used in the method.

First claim

Opening claim text (preview).

What is claimed is: 1. A pattern forming method, comprising: coating a substrate with a resist composition capable of forming a resist film of which solubility in a positive developer which is an alkali developer increases and solubility in a negative developer containing an organic solvent decreases upon irradiation with actinic rays or radiation, so as to form the resist film; exposing the resist film with an EUV light; developing the resist film with the negative developer containing an organic solvent; and washing the resist film with a rinsing solution containing a hydrocarbon-based organic solvent, wherein the resist composition contains a resin having an aromatic group, and the pattern forming method only includes negative development for developing the exposed resist film. 2. The pattern forming method according to claim 1 , wherein the hydrocarbon-based organic solvent is an aliphatic hydrocarbon based organic solvent. 3. The pattern forming method according to claim 1 , wherein the organic solvent in the negative developer contains an ester-based solvent. 4. A method of forming an electronic device, comprising the pattern forming method according to claim 1 . 5. The pattern forming method according to claim 1 , wherein the rinsing solution contains a hydrocarbon-based organic solvent and at least one of the group consisting of a ketone solvent, an ester solvent, an ether solvent, an alcohol solvent and an amide solvent.

Assignees

Inventors

Classifications

  • Treatment after imagewise removal, e.g. baking · CPC title

  • G03F7/325Primary

    Non-aqueous compositions · CPC title

  • Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021) · CPC title

  • Macromolecular compounds which are photodegradable, e.g. positive electron resists (G03F7/075 takes precedence; macromolecular quinonediazides G03F7/023) · CPC title

  • G03F7/0392Primary

    the macromolecular compound being present in a chemically amplified positive photoresist composition · CPC title

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What does patent US9291904B2 cover?
A pattern forming method, including: (A) coating a substrate with a positive resist composition of which solubility in a positive developer increases and solubility in a negative developer decreases upon irradiation with actinic rays or radiation, so as to form a resist film; (B) exposing the resist film; and (D) developing the resist film with a negative developer; a positive resist compositio…
Who is the assignee on this patent?
Fujifilm Corp
What technology area does this patent fall under?
Primary CPC classification G03F7/325. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).