Photoresist layer outgassing prevention
US-2024282577-A1 · Aug 22, 2024 · US
US9291904B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9291904-B2 |
| Application number | US-201414549164-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 20, 2014 |
| Priority date | Dec 25, 2006 |
| Publication date | Mar 22, 2016 |
| Grant date | Mar 22, 2016 |
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A pattern forming method, including: (A) coating a substrate with a positive resist composition of which solubility in a positive developer increases and solubility in a negative developer decreases upon irradiation with actinic rays or radiation, so as to form a resist film; (B) exposing the resist film; and (D) developing the resist film with a negative developer; a positive resist composition for multiple development used in the method; a developer for use in the method; and a rinsing solution for negative development used in the method.
Opening claim text (preview).
What is claimed is: 1. A pattern forming method, comprising: coating a substrate with a resist composition capable of forming a resist film of which solubility in a positive developer which is an alkali developer increases and solubility in a negative developer containing an organic solvent decreases upon irradiation with actinic rays or radiation, so as to form the resist film; exposing the resist film with an EUV light; developing the resist film with the negative developer containing an organic solvent; and washing the resist film with a rinsing solution containing a hydrocarbon-based organic solvent, wherein the resist composition contains a resin having an aromatic group, and the pattern forming method only includes negative development for developing the exposed resist film. 2. The pattern forming method according to claim 1 , wherein the hydrocarbon-based organic solvent is an aliphatic hydrocarbon based organic solvent. 3. The pattern forming method according to claim 1 , wherein the organic solvent in the negative developer contains an ester-based solvent. 4. A method of forming an electronic device, comprising the pattern forming method according to claim 1 . 5. The pattern forming method according to claim 1 , wherein the rinsing solution contains a hydrocarbon-based organic solvent and at least one of the group consisting of a ketone solvent, an ester solvent, an ether solvent, an alcohol solvent and an amide solvent.
Treatment after imagewise removal, e.g. baking · CPC title
Non-aqueous compositions · CPC title
Macromolecular compounds which are rendered insoluble or differentially wettable (G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021) · CPC title
Macromolecular compounds which are photodegradable, e.g. positive electron resists (G03F7/075 takes precedence; macromolecular quinonediazides G03F7/023) · CPC title
the macromolecular compound being present in a chemically amplified positive photoresist composition · CPC title
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