Methods for making low resistivity joints

US9287485B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9287485-B2
Application numberUS-201213415949-A
CountryUS
Kind codeB2
Filing dateMar 9, 2012
Priority dateMar 30, 2007
Publication dateMar 15, 2016
Grant dateMar 15, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

Method for joining wires using low resistivity joints is provided. More specifically, methods of joining one or more wires having superconductive filaments, such as magnesium diboride filaments, are provided. The wires are joined by a low resistivity joint to form wires of a desired length for applications, such in medical imaging applications.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of joining wires, the method comprising: introducing a magnesium diboride joint material to an end of a first wire and an end of a second wire at a joint area, wherein at least one of the first and second wires comprises superconductive magnesium diboride filaments, and wherein the magnesium diboride joint material comprises a solid joint material having bore holes formed therein; stripping the ends of each of the first and second wires to expose an extended portion of the superconductive magnesium diboride filaments of each of the first and second wires; inserting the extended portion of the superconductive magnesium diboride filaments of each of the first and second wires into the bore holes; and affecting the joint area such that the end of the first wire and the end of the second wire are electrically and mechanically coupled through the magnesium diboride joint material. 2. The method, as set forth in claim 1 , wherein each of the first and second wires comprises the superconductive magnesium diboride filaments. 3. The method, as set forth in claim 1 , wherein affecting the joint area comprises heating the joint area to sinter the superconductive magnesium diboride filaments of each of the first and second wires and the magnesium diboride joint material. 4. The method, as set forth in claim 1 , comprising: preparing the end of the first wire; and preparing the end of the second wire, before introducing the magnesium diboride joint material. 5. The method, as set forth in claim 1 , wherein stripping the ends of the first and second wires comprises stripping a cladding material to expose the extended portion of the superconductive magnesium diboride filaments of each of the first and second wires. 6. The method, as set forth in claim 1 , wherein the magnesium diboride joint material is doped. 7. The method, as set forth in claim 1 , wherein introducing a magnesium diboride joint material comprises disposing a composite material comprising magnesium diboride and at least one other material on the joint area. 8. The method, as set forth in claim 7 , wherein the at least one other material comprises a superconductor.

Assignees

Inventors

Classifications

  • H01L39/02Primary

    Electricity · mapped topic

  • characterised by the material, e.g. plating, or coating materials · CPC title

  • Assembling elongated conductors, e.g., splicing, etc. · CPC title

  • Superconductor · CPC title

  • H01R4/68Primary

    Connections to or between superconductive connectors · CPC title

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What does patent US9287485B2 cover?
Method for joining wires using low resistivity joints is provided. More specifically, methods of joining one or more wires having superconductive filaments, such as magnesium diboride filaments, are provided. The wires are joined by a low resistivity joint to form wires of a desired length for applications, such in medical imaging applications.
Who is the assignee on this patent?
Marte Judson Sloan, Huang Xianrui, Laskaris Evangelos Trifon, and 9 more
What technology area does this patent fall under?
Primary CPC classification H01L39/02. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 15 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).