Method for manufacturing solder column, apparatus for manufacturing solder column, and solder column

Patent metadata

Field	Value
Publication number	US-9283686-B2
Application number	US-201013522947-A
Country	US
Kind code	B2
Filing date	Jan 22, 2010
Priority date	Jan 22, 2010
Publication date	Mar 15, 2016
Grant date	Mar 15, 2016

Abstract

Solder wires are conveyed from insert openings for allowing the solder wires to be inserted toward discharge openings from which the solder wires are discharged and the solder wires project. The projecting wires are cut with first cutting blades and the solder wires inserted into the insert openings are cut with second cutting blades. This enables fixed cutting stress on a portion of the solder wires to be cut with the first cutting blades and a portion of the solder wires to be cut with the second cutting blades at the same time to prevent deformation of the cut surface of the cut solder wires. Solder columns having a column shape and having a uniform length along a conveying direction thereof can be manufactured.

First claim

The invention claimed is:

1. A method of manufacturing a solder column, the method comprising:
a first step of conveying a solder wire from an insert opening into a main body section and toward a discharge opening of the main body section, from which the solder wire inserted into the insert opening is discharged and projecting the solder wire from the discharge opening;
a second step of cutting the solder wire projected from the discharge opening with a first cutting blade and cutting the solder wire inserted into the insert opening with a second cutting blade wherein each of the first and second cutting blades is a single edge blade in which a parallel surface is in parallel with a direction in which each blade extends an inclined surface is at a predetermined angle to the parallel surface, and the inclined surface of the first cutting blade is inclined in an opposite direction to the inclined surface of the second cutting blade, the second step also including sliding the parallel surface of the first cutting blade against the discharge opening and sliding the parallel surface of the second cutting blade against the insert opening and cutting the wire with said parallel surfaces in contact against outer surfaces of the main body section; and
further comprising a step of cutting an end of the solder wire to be inserted into the insert opening with a third cutting blade; and
wherein the solder wire is supported between the insert opening and the discharge opening and the solder wire is not supported between the second and third cutting blades.

2. The method of manufacturing a solder column according to claim 1 wherein the first cutting blade is provided so that a rear end of the first cutting blade is inclined in a direction away from the discharge opening; and
the second cutting blade is provided so that a rear end of the second cutting blade is inclined in a direction away from the insert opening.

3. The method of manufacturing a solder column according to claim 2 wherein an angle between the first cutting blade and the discharge opening and an angle between the second cutting blade and the insert opening are 5 degrees through 15 degrees.

4. The method of manufacturing a solder column according to claim 1 wherein
the first cutting blade is curved to cut the solder wire projected from the discharge opening, and the second cutting blade is curved to cut the solder wire inserted into the insert opening.

5. The method of manufacturing a solder column according to claim 1 wherein the second step includes applying force to the first cutting blade in a direction which is opposite to a conveying direction of the solder wire to cut the solder wire projected from the discharge opening with the first cutting blade, and applying force to the second cutting blade in the conveying direction of the solder wire to cut the solder wire inserted into the insert opening with the second cutting blade.

6. The method of manufacturing a solder column according to claim 1 wherein the second step includes cutting the solder wire projected from the discharge opening and the solder wire inserted into the insert opening at the same time with the first and second cutting blades.

7. The method of manufacturing a solder column according to claim 1 wherein by conveying the end of the solder wire cut with the third cutting blade from the insert opening toward the discharge opening, the solder column, which has been cut with the first and second cutting blades, and which remained between the insert opening and the discharge opening, is pushed out.

8. The method of manufacturing a solder column according to claim 1 wherein thicknesses of the first through third cutting blades are 0.3 mm through 0.6 mm.

9. The method of manufacturing a solder column according to claim 1 , including manufacturing the solder column with a diameter of 0.2 mm through 0.6 mm and a length of 1 mm through 2.54 mm.

10. The method of manufacturing a solder column according to claim 1 , including manufacturing the solder column of solder having a composition of 89.5-95% (by mass) Pb and 5-10.5% (by mass) Sn.

11. The method of manufacturing a solder column according to claim 1 , including cutting a surface of the solder column to a squareness of 0.015 mm through 0.05 mm.

12. The method of manufacturing a solder column according to claim 1 , including cutting parallel processed lines with the first cutting blade and the second cutting blade.

13. An apparatus for performing the method of manufacturing a solder column, comprising:
a main body section having an insert opening for allowing a solder wire to be inserted and a discharge opening from which the solder wire inserted into the insert opening is discharged;
a conveying mechanism that conveys the solder wire from the insert opening toward the discharge opening;
a first cutting blade that cuts the solder wire projecting from the discharge opening, the first cutting blade being provided in position to slide against the discharge opening;
a second cutting blade that cuts the solder wire inserted into the insert opening, the second cutting blade being provided in position to slide against the insert opening;
wherein each of the first and second cutting blades is a single edge blade in which a parallel surface is in parallel with a direction in which each blade extends, and an inclined surface is at a predetermined angle to the parallel surface, and the inclined surface of the first cutting blade is inclined in an opposite direction to the inclined surface of the second cutting blade; the parallel surface of the first cutting blade sliding against the discharge opening when cutting the solder wire and the parallel surface of the second cutting blade sliding against the insert opening when cutting the solder wire;
a third cutting blade that cuts the solder wire to be inserted into the insert opening;
a controlling portion that causes the solder wire to be projected from the discharge opening by the conveying mechanism, causes the projected solder wire to be cut with the first cutting blade and causes the solder wire inserted into the insert opening to be cut with the second cutting blade and;
wherein the solder wire is supported between the insert opening and the discharge opening and the solder wire is not supported between the second and third cutting blades.

14. The apparatus of claim 13 wherein the first cutting blade is provided so that a rear end of the first cutting blade is inclined in a direction away from the discharge opening; and
the second cutting blade is provided so that a rear end of the second cutting blade is inclined in a direction away from the insert opening.

15. The apparatus of claim 14 wherein an angle between the first cutting blade and the discharge opening and an angle between the second cutting blade and the insert opening are within the range of 5 degrees through 15 degrees.

16. The apparatus of claim 13 , wherein
the controlling portion allows the first cutting blade to be in contact against the main body portion and to be curved, thereby sliding the parallel surface of the curved first cutting blade against the discharge opening to cut the solder wire projected from the discharge opening with the first cutting blade, and allows the second cutting blade to be in contact against the main body portion and to be curved, thereby sliding the parallel surface of the curved second cutting blade against the insert opening to cut the solder wire inserted into the insert opening with the second cutting blade.

17. The apparatus of claim 13 wherein the first

Assignees

• Nomoto Shinichi
• Nauchi Takashi
• Senju Metal Industry Co

Inventors

• Nomoto Shinichi
• Nauchi Takashi

Classifications

• H10W70/093

  Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps · CPC title

• B26D1/06 Primary

  wherein the cutting member reciprocates (cup or like cutting members B26D1/44) · CPC title

• B23K35/40

  Making wire or rods for soldering or welding · CPC title

• B23K35/26 Primary

  with the principal constituent melting at less than 400°C · CPC title

• H01L21/4853

  Electricity · mapped topic