Process liquid changing method and substrate processing apparatus

Patent metadata

Field	Value
Publication number	US-9278768-B2
Application number	US-201313774091-A
Country	US
Kind code	B2
Filing date	Feb 22, 2013
Priority date	Feb 24, 2012
Publication date	Mar 8, 2016
Grant date	Mar 8, 2016

Abstract

A process liquid changing method is provided for changing process liquids in a substrate processing apparatus including storage tank, a circulation line with a circulation pump, and a process liquid supply nozzle connected to the circulation line through a branch line. The method includes: discharging the process liquid in the storage tank; discharging a process liquid remaining in the circulation line from a drain connected to the circulation line at a second position of the circulation line, while supplying a purge gas to the circulation line at a first position of the circulation line, wherein the first position is located upstream of a junction area where the branch line is connected to the circulation line, and the second position is located downstream of the junction area and upstream of the storage tank; and supplying a process liquid into the storage tank.

First claim

The invention claimed is:

1. A substrate processing apparatus comprising:
a storage tank configured to store a process liquid;
a circulation line having ends thereof connected to the storage tank;
a circulation pump provided on the circulation line;
a process liquid supply nozzle connected to the circulation line through a branch line; and
a circulation line purging mechanism that removes the process liquid existing in a zone of the circulation line on demand, the zone extending from a first position to a second position and including a junction area where the branch line is connected to the circulation line between the first and second positions;
wherein the circulation line purging mechanism includes:
a purge gas supply unit that supplies a purge gas to the circulation line from the first position of the circulation line to drive the process liquid existing in the zone of the circulation line downstream;
a drain unit having a drain line connected to the second position of the circulation line, the drain line having a first on-off valve to allow the process liquid, which is being driven downstream through the zone of the circulation line by the purge gas supplied by the purge gas supply unit, to be drained from the circulation line through the drain line,
the drain unit further comprising a second on-off valve to prevent process liquid from being driven from the second position into the storage tank by the purge gas.

2. The substrate processing apparatus according to claim 1 , wherein the first position is located downstream of the circulation pump, and a third on-off valve is provided between the first position and the circulation pump.

3. The substrate processing apparatus according to claim 2 , further comprising a drain part having a fourth on-off valve which is connected to a filter provided on the circulation line between the circulation pump and the third on-off valve to drain the process liquid from the filter.

4. The substrate processing apparatus according to claim 1 , wherein the storage tank is provided with a drain unit configured to discharge a liquid existing in the storage tank.

Assignees

• Tokyo Electron Ltd

Inventors

• Kasahara Masatoshi
• Shimomura Shinichiro

Classifications

• H10P72/0402 Primary

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• H10P50/00 Primary

  Etching of wafers, substrates or parts of devices · CPC title

• B65B3/04 Primary

  Methods of, or means for, filling the material into the containers or receptacles · CPC title

• H01L21/67017

  Electricity · mapped topic