Processing method for optical device wafer

Patent metadata

Field	Value
Publication number	US-9275848-B2
Application number	US-201414554479-A
Country	US
Kind code	B2
Filing date	Nov 26, 2014
Priority date	Dec 5, 2013
Publication date	Mar 1, 2016
Grant date	Mar 1, 2016

Abstract

A method of processing an optical device wafer which includes a laser processing step of repeating an application of one pulse of a pulsed laser beam to the optical device wafer to form one laser processed hole, thereby forming a plurality of laser processed holes along streets; an etching step of causing an etchant to enter into the laser processed holes to etch the inside of the laser processed holes; and a dividing step of exerting an external force on the optical device wafer to divide the optical device wafer along the streets, thereby forming a plurality of optical devices.

First claim

What is claimed is:

1. A method of processing an optical device wafer having an optical device layer stacked on a front surface of a substrate, the optical device layer being sectioned into regions partitioned by a plurality of crossing streets, and an optical device being formed in each of the regions, the method comprising:
a laser processing step of repeating an application of a pulsed laser beam of such a wavelength as to be absorbable in the optical device wafer to the optical device wafer to form one laser processed hole by one pulse, thereby forming a plurality of laser processed holes along the streets;
an etching step of causing, after execution of the laser processing step, an etchant to enter into the laser processed holes, thereby etching internal surfaces of the laser processed holes; and
a dividing step of exerting, after execution of the etching step, an external force on the optical device wafer to divide the optical device wafer along the streets, thereby forming a plurality of optical device chips.

2. The method of processing the optical device wafer according to claim 1 , further comprising:
a protective film forming step of forming, before execution of the laser processing step, a protective film on the front surface of the optical device wafer; and
a protective film removing step of removing the protective film, at least after execution of the laser processing step,
wherein in the laser processing step the pulsed laser beam is applied toward the front surface side of the optical device wafer.

Assignees

• Disco Corp

Inventors

• Arakawa Taro

Classifications

• H10P54/00 Primary

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10P95/00 Primary

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• B23K26/18 Primary

  using absorbing layers on the workpiece, e.g. for marking or protecting purposes · CPC title

• B23K26/4075

  Operations & Transport · mapped topic

• H01L21/00 Primary

  Electricity · mapped topic