Apparatus for plating process

Patent metadata

Field	Value
Publication number	US-9255331-B2
Application number	US-201414568384-A
Country	US
Kind code	B2
Filing date	Dec 12, 2014
Priority date	Sep 11, 2008
Publication date	Feb 9, 2016
Grant date	Feb 9, 2016

Abstract

An apparatus for a plating process includes: an outer chamber; an inner chamber covered by the outer chamber; a rotatable holding mechanism configured to hold a substrate horizontally and installed in the inner chamber; a fluid supply unit configured to supply a plating solution to a preset position on the substrate; a gas supply device configured to generate a nonreactive gas and control a temperature of the nonreactive gas; a gas supply hole configured to supply the nonreactive gas into the outer chamber and provided in a top surface of the outer chamber; a plurality of gas inlet openings provided at a sidewall of the inner chamber and spaced apart at equal distances; and a rectifying plate disposed above the substrate and below the plurality of gas inlet openings inside the inner chamber, the rectifying plate having a plurality of rectifying holes uniformly disposed in the rectifying plate.

First claim

What is claimed is:

1. A plating apparatus for a plating process, comprising:
an outer chamber;
an inner chamber covered by the outer chamber;
a rotatable holding mechanism configured to hold a substrate horizontally and installed in the inner chamber;
a fluid supply unit configured to supply a plating solution to a preset position on the substrate;
a gas supply device configured to generate a nonreactive gas and control a temperature of the nonreactive gas;
a gas supply hole configured to supply the nonreactive gas into the outer chamber and provided in a top surface of the outer chamber;
a plurality of gas inlet openings provided at a sidewall of the inner chamber and spaced apart at equal distances; and
a rectifying plate disposed above the substrate and below the plurality of gas inlet openings inside the inner chamber, the rectifying plate having a plurality of rectifying holes uniformly disposed in the rectifying plat;
wherein a sidewall of the outer chamber circumferentially surrounds the sidewall of the inner chamber.

2. The plating apparatus of claim 1 , wherein the gas supply device is configured to control the temperature of the nonreactive gas to be equal to or higher than a preset plating process temperature.

3. The plating apparatus of claim 1 , further comprising:
a gas supply valve configured to control an amount of the nonreactive gas supplied into the outer chamber.

4. The plating apparatus of claim 1 , further comprising:
a first gas exhaust pump and a first gas exhaust valve connected with the outer chamber and configured to control an exhaust amount of the nonreactive gas flowing between the outer chamber and the inner chamber.

5. The plating apparatus of claim 1 , further comprising:
a second gas exhaust pump and a second gas exhaust valve connected with the inner chamber and configured to control an exhaust amount of the nonreactive gas flowing inside the inner chamber.

Assignees

• Tokyo Electron Ltd

Inventors

• Tanaka Takashi
• Saito Yusuke
• Iwashita Mitsuaki

Classifications

• H10P14/46 Primary

  using a liquid · CPC title

• C23C18/1682

  Control of atmosphere · CPC title

• C23C18/1632 Primary

  Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells · CPC title

• C23C18/31

  Coating with metals · CPC title

• C23C18/1678

  Heating of the substrate · CPC title