Methods of fabricating low melting point solder reinforced sealant and structures formed thereby

Patent metadata

Field	Value
Publication number	US-9254532-B2
Application number	US-65540709-A
Country	US
Kind code	B2
Filing date	Dec 30, 2009
Priority date	Dec 30, 2009
Publication date	Feb 9, 2016
Grant date	Feb 9, 2016

Abstract

Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material.

First claim

What is claimed is:

1. A structure comprising:
a substrate having a substrate solder resist opening (SRO) location and a keep out zone;
a sealant in direct contact with the substrate in the keep out zone of the substrate;
an integrated heat spreader (IHS) having a nickel coated portion and an exposed copper portion, the exposed copper portion of the integrated heat spreader (IHS) attached to the sealant in the keep out zone of the substrate, and wherein the nickel coated portion is disposed on an upper portion of the integrated heat spreader (IHS) and a first inner portion of the integrated heat spreader (IHS); and
a solder joint disposed between the substrate solder resist opening (SRO) location and the integrated heat spreader (IHS), the solder joint directly attaching the integrated heat spreader (IHS) to the substrate at the solder resist opening location.

2. The structure of claim 1 wherein the solder joint comprises a material with a melting point substantially the same or below the sealant melting point.

3. The structure of claim 1 wherein the sealant comprises a melting point below 165 degrees Celsius.

4. The structure of claim 1 further comprising a second inner portion of the integrated heat spreader (IHS) that does not comprise the nickel coated portion.

5. The structure of claim 1 further comprising wherein the substrate comprises a portion of a microelectronic package.

6. The structure of claim 1 further comprising wherein the solder resist opening (SRO) location is located in at least one of a corner of the integrated heat spreader (IHS) or near a notch location of the integrated heat spreader (IHS).

7. The structure of claim 1 wherein the integrated heat spreader (IHS) comprises copper and the sealant comprises silicone.

8. A microelectronic package comprising:
a die attached to a substrate;
an integrated heat spreader (IHS) having a nickel coated portion and an exposed copper portion thermally coupled to said die and attached to said substrate, wherein the integrated heat spreader (IHS) is directly attached to said substrate at a first location by a solder joint and wherein the exposed copper portion of the integrated heat spreader (IHS) is directly attached to said substrate at a second location different than said first location by a sealant, and wherein the nickel coated portion is disposed on an upper portion of the integrated heat spreader (IHS) and a first inner portion of the integrated heat spreader (IHS) that is not thermally coupled to the die.

9. The microelectronic package of claim 8 wherein the solder joint comprises a material with a melting point substantially the same or below the melting point of said sealant.

10. The microelectronic package of claim 8 wherein the sealant has a melting point below 165° C.

11. The microelectronic package of claim 8 wherein the first location is in at least one of a corner of the integrated heat spreader (IHS) or near a notch location of the integrated heat spreader (IHS).

12. The microelectronic package of claim 8 wherein the integrated heat spreader (IHS) comprises copper and the sealant comprises silicone.

Assignees

• Kulkarni Deepak V
• Deppisch Carl L
• Arana Leonel R
• Constable Gregory S
• Srinivasan Sriram
• Intel Corp

Inventors

• Kulkarni Deepak V
• Deppisch Carl L
• Arana Leonel R
• Constable Gregory S
• Srinivasan Sriram

Classifications

• B23K1/203

  Fluxing, i.e. applying flux onto surfaces · CPC title

• B23K1/20

  Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title