Method of forming a substrate core with embedded capacitor and structures formed thereby
US-9572258-B2 · Feb 14, 2017 · US
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Srinivasan Sriram patents
Srinivasan Sriram holds 6 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 6 |
| Recent patents | 0 |
| First publication | Aug 25, 2015 |
| Latest publication | Feb 14, 2017 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Supporting ETL processing in BPEL-based processes
US-9542656-B2 · Jan 10, 2017 · US
Managing application parameters based on parameter types
US-9361137-B2 · Jun 7, 2016 · US
Methods of fabricating low melting point solder reinforced sealant and structures formed thereby
US-9254532-B2 · Feb 9, 2016 · US
3D integrated circuit package with window interposer
US-9129958-B2 · Sep 8, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Method of forming a substrate core with embedded capacitor and structures formed thereby
US-9572258-B2 · Feb 14, 2017 · US
Supporting ETL processing in BPEL-based processes
US-9542656-B2 · Jan 10, 2017 · US
Managing application parameters based on parameter types
US-9361137-B2 · Jun 7, 2016 · US
Methods of fabricating low melting point solder reinforced sealant and structures formed thereby
US-9254532-B2 · Feb 9, 2016 · US
3D integrated circuit package with window interposer
US-9129958-B2 · Sep 8, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W90/724 | 2 |
| H01L2224/16225 | 2 |
| B23K1/203 | 1 |
| B23K1/20 | 1 |
| H10W72/877 | 1 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 4 |
| Cross-Sectional Technologies | 3 |
| Physics | 2 |
| Operations & Transport | 1 |