Multi-cup LED assembly

Patent metadata

Field	Value
Publication number	US-9252336-B2
Application number	US-23955208-A
Country	US
Kind code	B2
Filing date	Sep 26, 2008
Priority date	Sep 26, 2008
Publication date	Feb 2, 2016
Grant date	Feb 2, 2016

Abstract

A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.

First claim

The invention claimed is:

1. A device, comprising:
an LED assembly comprising:
a substrate;
at least three cups comprising a first cup, a second cup, and a third cup formed in the substrate and arranged so that each cup except the first cup is formed in a floor of a preceding cup generally co-axial with respect to one another and each of the at least three cups includes a floor and a wall surface;
a cover layer formed on the substrate in the first cup and the second cup, wherein the cover layer is formed on the floor and the watt surface of each of the first cup and the second cup but is not formed on the substrate in the third cup such that an entire portion of the substrate is exposed along the floor and the wall surface of the third cup; and
at least one LED chip disposed on the exposed portion of substrate on the floor of the third cup.

2. The device as recited in claim 1 , wherein each of the at least three cups are substantially reflective.

3. The device as recited in claim 1 , wherein each of the at least three cups are formed by machining.

4. The device as recited in claim 1 , wherein each of the at least three cups are formed by milling.

5. The device as recited in claim 1 , wherein at least one of the at least three cups is round.

6. The device as recited in claim 1 , wherein at least one of the at least three cups is square.

7. The device as recited in claim 1 , wherein a first one of the at least three cups is round and a second one of the at least three cups is square.

8. The device as recited in claim 1 , the wall surface of at least one of the at least three cups is substantially reflective.

9. The device as recited in claim 1 , wherein the substrate comprises metal.

10. The device as recited in claim 1 , wherein the substrate comprises at least one material selected from the group consisting of:
aluminum;
copper;
aluminum nitride;
ceramic; and
FR4.

11. The device as recited in claim 1 , wherein the cover layer comprises a dielectric layer formed on the substrate in the first cup and the second cup, wherein the dielectric layer is not formed on the substrate in the third cup.

12. The device as recited in claim 11 , further comprising a metal layer formed on the substrate in the first cup and the second cup, wherein the metal layer is not formed on the substrate in the third cup.

13. The device as recited in claim 12 wherein the dielectric layer is formed between the substrate and the metal layer in the first cup and the second cup.

14. The device as recited in claim 12 , wherein the dielectric layer and the metal layer are formed on the wall surface of the first cup and the wall surface of the second cup.

15. The device as recited in claim 14 , wherein the dielectric layer and the metal layer are formed on the floor of the first cup and the floor of the second cup.

16. The device as recited in claim 1 , further comprising a ring formed on the substrate.

17. The device as recited in claim 14 , wherein the dielectric layer and the metal layer are not formed on the wall surface of the third cup.

18. The device as recited in claim 17 , wherein the dielectric layer and the metal layer are not formed on the floor of the third cup.

19. The device as recited in claim 1 , wherein the wall surface of at least one of the at least three cups is sloped.

Assignees

• Shi Wei
• Shaikevitch Alex
• Bao Shanquan
• Solomensky Michael
• Bridgelux Inc

Inventors

• Shi Wei
• Shaikevitch Alex
• Bao Shanquan
• Solomensky Michael

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title

• H10H29/8506

  Containers · CPC title

• H10H29/8508 Primary

  Package substrates, e.g. submounts · CPC title