Illumination device

Patent metadata

Field	Value
Publication number	US-10989396-B2
Application number	US-202016876987-A
Country	US
Kind code	B2
Filing date	May 18, 2020
Priority date	May 29, 2012
Publication date	Apr 27, 2021
Grant date	Apr 27, 2021

Abstract

An illumination device includes a supporting base, and a light-emitting element inserted in the supporting base. The light-emitting element includes a substrate having a supporting surface and a side surface, a light-emitting chip disposed on the supporting surface, and a first wavelength conversion layer covering the light-emitting chip and only a portion of the supporting surface without covering the side surface.

First claim

What is claimed is:

1. An illumination device, comprising:
a supporting base;
a transparent substrate coupled to the supporting base;
a plurality of LED structures disposed on the transparent substrate;
a wavelength conversion layer formed on the transparent substrate; and
a bonding layer disposed between the transparent substrate and each LED structure,
wherein the transparent substrate and the supporting base are arranged to form an angle, and
wherein the plurality of LED structures emits different color lights.

2. The illumination device of claim 1 , wherein at least one of plurality of LED structures is a flip chip.

3. The illumination device of claim 1 , further comprising a connecting conductor formed on the transparent substrate.

4. The illumination device of claim 3 , wherein the connecting conductor is exposed from the wavelength conversion layer.

5. The illumination device of claim 1 , wherein the angle ranges from 30 degree to 150 degree.

6. The illumination device of claim 1 , further comprising a first connecting electrode and a second connecting electrode which are disposed on opposite ends of the transparent substrate.

7. The illumination device of claim 1 , wherein the supporting base has a central axis, the plurality of LED structures is arranged to face to the central axis.

8. The illumination device of claim 1 , wherein the supporting base has a central axis, the plurality of LED structures is arranged with its back to the central axis.

9. The illumination device of claim 1 , further comprising a lamp housing enclosing the supporting base, the transparent substrate, and the plurality of LED structures.

10. The illumination device of claim 1 , wherein the wavelength conversion layer directly contacts the transparent substrate.

11. An illumination device, comprising:
a supporting base;
a transparent substrate coupled to the supporting base;
a plurality of LED structures disposed on the transparent substrate; and
a bonding layer disposed between the transparent substrate and each of the plurality of LED structures,
wherein the transparent substrate and the supporting base are arranged to form an angle ranged of 30-150 degrees, and
wherein the plurality of LED structures emits different color lights.

12. The illumination device of claim 11 , wherein at least one of plurality of LED structures is a flip chip.

13. The illumination device of claim 11 , further comprising a connecting conductor formed on the transparent substrate.

14. The illumination device of claim 13 , further comprising a wavelength conversion layer directly formed on the transparent substrate.

15. The illumination device of claim 11 , further comprising a first connecting electrode and a second connecting electrode which are disposed on opposite ends of the transparent substrate.

16. The illumination device of claim 11 , wherein the supporting base has a central axis, the plurality of LED structures is arranged to face to the central axis.

17. The illumination device of claim 11 , wherein the supporting base has a central axis, the plurality of LED structures is arranged with its back to the central axis.

18. The illumination device of claim 11 , further comprising a lamp housing enclosing the supporting base, the transparent substrate, and the plurality of LED structures.

19. The illumination device of claim 11 , further comprising an optic layer continuously covering the plurality of LED structures.

20. The illumination device of claim 19 , wherein the optic layer directly contacts the transparent substrate.

Assignees

• Epistar Corp

Inventors

• Ho Chih-Ping
• Liao Chih-Wei
• Pan Shyi-Ming

Classifications

• H10W72/5524

  comprising aluminium [Al] · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title