Light-emitting module and display device

Patent metadata

Field	Value
Publication number	US-10986725-B2
Application number	US-201916373945-A
Country	US
Kind code	B2
Filing date	Apr 3, 2019
Priority date	Apr 19, 2018
Publication date	Apr 20, 2021
Grant date	Apr 20, 2021

Abstract

A light-emitting module is provided. The light-emitting module includes a light-emitting structure and a carrying substrate. The light-emitting structure includes a plurality of light-emitting elements and a first positioning mark. The carrying substrate includes a second positioning mark. The light-emitting structure is fixed on the carrying substrate along a direction, and the first positioning mark and the second positioning mark overlap in the direction.

First claim

What is claimed is:

1. A light-emitting module, comprising:
a light-emitting structure comprising a plurality of light-emitting elements, a circuit board, a solder pad, and a first positioning mark, wherein at least one of the plurality of light-emitting elements is electrically connected to the circuit board via the solder pad; and
a carrying substrate comprising a second positioning mark,
wherein the light-emitting structure is fixed on the carrying substrate along a direction, and the first positioning mark and the second positioning mark overlap in the direction and are not covered by the plurality of light-emitting elements, and wherein the first positioning mark is disposed in the circuit board, or the first positioning mark comprises a portion of the solder pad.

2. The light-emitting module as claimed in claim 1 , wherein the first positioning mark comprises a metal mark.

3. The light-emitting module as claimed in claim 1 , wherein the light-emitting structure further comprises a substrate and the circuit board is disposed on the substrate, a first hole is formed in the circuit board, and the first positioning mark comprises the first hole.

4. The light-emitting module as claimed in claim 1 , wherein the at least one of the plurality of light-emitting elements covers a portion of the solder pad and exposes another portion of the solder pad, and the first positioning mark comprises the exposed another portion of the solder pad.

5. The light-emitting module as claimed in claim 4 , wherein the light-emitting structure further comprises a solder material disposed between the solder pad and the at least one of the plurality of light emitting elements.

6. The light-emitting module as claimed in claim 1 , wherein the second positioning mark comprises a metal mark.

7. The light-emitting module as claimed in claim 1 , wherein a second hole is formed in the carrying substrate, and the second positioning mark comprises the second hole.

8. The light-emitting module as claimed in claim 7 , wherein the second hole penetrates the carrying substrate.

9. The light-emitting module as claimed in claim 1 , wherein the light-emitting structure further comprises:
an electronic component disposed on the circuit board, wherein the first positioning mark comprises the electronic component.

10. The light-emitting module as claimed in claim 1 , wherein a shape of the first positioning mark is substantially the same as a shape of the second positioning mark.

11. The light-emitting module as claimed in claim 1 , wherein the carrying substrate comprises metal material.

12. The light-emitting module as claimed in claim 1 , further comprising a bonding layer disposed between the light-emitting structure and the carrying substrate.

13. The light-emitting module as claimed in claim 12 , wherein the light-emitting structure further comprises a substrate having a first surface and a second surface, the plurality of light-emitting elements are disposed on the first surface, and the bonding layer is adhered between the second surface and the carrying substrate.

14. The light-emitting module as claimed in claim 12 , wherein the circuit board is in contact with the bonding layer.

15. A tiled display device, comprising:
a cabinet; and
a plurality of light-emitting modules disposed in the cabinet, wherein at least one of the plurality of light-emitting modules comprises:
a light-emitting structure comprising a plurality of light-emitting elements, a circuit board, a solder pad, and a first positioning mark, wherein at least one of the plurality of light-emitting elements is electrically connected to the circuit board via the solder pad; and
a carrying substrate comprising a second positioning mark,
wherein the light-emitting structure is fixed on the carrying substrate along a direction, and the first positioning mark and the second positioning mark overlap in the direction and are not covered by the plurality of light-emitting elements, and wherein the first positioning mark is disposed in the circuit board, or the first positioning mark comprises a portion of the solder pad.

16. The tiled display device as claimed in claim 15 , wherein the plurality of light-emitting elements are light-emitting diodes.

17. The tiled display device as claimed in claim 15 , wherein the light-emitting structure further comprises a substrate and the circuit board is disposed on the substrate.

18. The tiled display device as claimed in claim 17 , wherein the light-emitting structure further comprises an electronic component disposed on the circuit board, a second hole is formed in the carrying substrate, the first positioning mark comprises the electronic component, and the second positioning mark comprises the second hole.

19. The tiled display device as claimed in claim 15 , further comprising an optical layer disposed between the plurality of light-emitting elements.

20. A display device, comprising:
a display panel; and
a light-emitting module providing a light source for the display panel, wherein the light-emitting module comprises:
a light-emitting structure comprising a plurality of light-emitting elements, a circuit board, a solder pad, and a first positioning mark, wherein at least one of the plurality of light-emitting elements is electrically connected to the circuit board via the solder pad; and
a carrying substrate comprising a second positioning mark,
wherein the light-emitting structure is fixed on the carrying substrate along a direction, and the first positioning mark and the second positioning mark overlap in the direction and are not covered by the plurality of light-emitting elements, and wherein the first positioning mark is disposed in the circuit board, or the first positioning mark comprises a portion of the solder pad.

Assignees

• Innolux Corp

Inventors

• Chang Chi-Liang
• Tsai Wen-Chang
• Cheng Meng-Chieh

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10H29/036

  of packages · CPC title

• H10H29/8508 Primary

  Package substrates, e.g. submounts · CPC title

• H05K1/0269 Primary

  for visual or optical inspection · CPC title

• H05K5/30

  Side-by-side or stacked arrangements · CPC title