Manufacturing method for monolithic ceramic electronic component

Patent metadata

Field	Value
Publication number	US-9240333-B2
Application number	US-201414454869-A
Country	US
Kind code	B2
Filing date	Aug 8, 2014
Priority date	Mar 14, 2011
Publication date	Jan 19, 2016
Grant date	Jan 19, 2016

Abstract

In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.

First claim

What is claimed is:

1. A manufacturing method for a monolithic ceramic electronic component, comprising the steps of:
preparing a mother block including a plurality of ceramic green sheets that are stacked on each other, and an internal electrode pattern arranged along each of a plurality of interfaces between the ceramic green sheets;
performing a first cutting including cutting the mother block along a first cutting line to obtain a plurality of rod-shaped green block bodies, the rod-shaped green block bodies each having a laminated structure including a plurality of ceramic layers and a plurality of internal electrodes that are in a raw state, the internal electrodes being exposed on a cut side surface that is produced by the first cutting along the first cutting line;
affixing a side surface ceramic green sheet to the cut side surface to form a raw ceramic protective layer;
performing a second cutting including cutting each of the rod-shaped green block bodies along a second cutting line extending in a direction perpendicular or substantially perpendicular to the first cutting line to obtain a plurality of raw component bodies that are each a component body in a raw state;
firing the plurality of raw component bodies; and
applying an adhesive between the side surface ceramic green sheet and the cut side surface, the step of applying the adhesive being performed on the plurality of raw component bodies or on the side surface ceramic green sheet; wherein
the affixing step includes the steps of:
placing the side surface ceramic green sheet on an affixation elastic body;
pressing the cut side surface against the side surface ceramic green sheet with a force that substantially elastically deforms the affixation elastic body through compression; and
separating each of the plurality of raw component bodies or the plurality of rod-shaped green block bodies from the affixation elastic body in a state in which the side surface ceramic green sheet is stuck to the cut side surface;

in the affixing step, the plurality of raw component bodies or the plurality of rod-shaped green block bodies are affixed onto an adhesive sheet while the side surface ceramic green sheet is affixed to the cut side surface; and
the affixation elastic body has an elastic coefficient of not more than about 50 MPa.

2. The manufacturing method for a monolithic ceramic electronic component according to claim 1 , wherein:
the affixing step is performed prior to the second cutting step.

3. The manufacturing method for a monolithic ceramic electronic component according to claim 1 , wherein:
the affixing step is performed after the second cutting step.

4. The manufacturing method for a monolithic ceramic electronic component according to claim 1 , wherein:
the adhesive sheet has expandability; and
the method further comprises the step of:
expanding the adhesive sheet on which the plurality of raw component bodies or the plurality of rod-shaped green block bodies have been affixed, so that the plurality of raw component bodies or the plurality of rod-shaped green block bodies become spaced apart from each other.

5. The manufacturing method for a monolithic ceramic electronic component according to claim 1 , wherein:
the side surface ceramic green sheet has dimensions larger than the cut side surface; and
the step of pressing the cut side surface against the side surface ceramic green sheet includes the step of punching the side surface ceramic green sheet using an edge of the cut side surface.

6. The manufacturing method for a monolithic ceramic electronic component according to claim 1 , wherein:
the side surface ceramic green sheet has dimensions larger than the cut side surface; and
the manufacturing method further comprises the step of, after the affixing step, removing an unnecessary portion of the side surface ceramic green sheet other than a portion that is affixed to the cut side surface.

7. The manufacturing method for a monolithic ceramic electronic component according to claim 1 , further comprising the step of thermo-compression bonding each of the plurality of raw component bodies or the plurality of rod-shaped green block bodies and the raw ceramic protective layer together at a temperature of not higher than about 200° C. to improve adhesion thereof, after forming the raw ceramic protective layer by affixing the side surface ceramic green sheet to the cut side surface.

8. The manufacturing method for a monolithic ceramic electronic component according to claim 1 , further comprising the step of forming an external electrode on a predetermined surface of the component body so as to be electrically connected to a specific one of the internal electrodes.

9. A manufacturing method for a monolithic ceramic electronic component, comprising the steps of:
preparing a mother block including a plurality of ceramic green sheets that are stacked on each other, and an internal electrode pattern arranged along each of a plurality of interfaces between the ceramic green sheets;
cutting the mother block along a first cutting line and a second cutting line extending in a direction perpendicular or substantially perpendicular to the first cutting line to obtain a plurality of green chips, the green chips each having a laminated structure including a plurality of ceramic layers and a plurality of internal electrodes that are in a raw state, the internal electrodes being exposed on a cut side surface that is produced by cutting along the first cutting line;
affixing a side surface ceramic green sheet to the cut side surface to form a raw ceramic protective layer;
firing the plurality of green chips; and
applying an adhesive between the side surface ceramic green sheet and the cut side surface, the step of applying the adhesive being performed on the plurality of green chips or on the side surface ceramic green sheet; wherein
the affixing step includes the steps of:
placing the side surface ceramic green sheet on an affixation elastic body having an elastic coefficient of not more than about 50 MPa;
pressing the cut side surface against the side surface ceramic green sheet with a force that substantially elastically deforms the affixation elastic body through compression; and
separating each of the plurality of green chips from the affixation elastic body in a state in which the side surface ceramic green sheet is stuck to the cut side surface; and

in the affixing step, the plurality of green chips are affixed onto an adhesive sheet while the side surface ceramic green sheet is affixed to the cut side surface.

Assignees

• Murata Manufacturing Co

Inventors

• Matsui Togo
• Dooka Minoru
• Takashima Hiroyoshi
• Okajima Kenichi

Classifications

• H10P95/00 Primary

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• C04B37/006

  consisting of metals or metal salts · CPC title

• C04B2237/12

  Metallic interlayers · CPC title

• B32B38/04

  Punching, slitting or perforating · CPC title