Conductive structure body precursor, conductive structure body and method for manufacturing the same
US-2015370359-A1 · Dec 24, 2015 · US
Bonding material and bonding method using the same
US9240256B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9240256-B2 |
| Application number | US-201013576014-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 23, 2010 |
| Priority date | Mar 15, 2010 |
| Publication date | Jan 19, 2016 |
| Grant date | Jan 19, 2016 |
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- Title
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Abstract
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A method of forming a bonded product using metal nanoparticles is provided. More specifically, provided is a paste containing a flux component that can form a metal phase even in an inert atmosphere. The use of this paste allows a bonding material that can give a practically acceptable bonding strength to be provided in an inert atmosphere such as a nitrogen atmosphere at low temperatures without performing conventionally used pressurization. The paste is a bonding material configured to include: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic material having 8 or less carbon atoms; a flux component having at least two carboxyl groups; and a dispersion medium. The use of this bonding material allows materials to be bonded even at a temperature of 300° C. or lower.
First claim
Opening claim text (preview).
The invention claimed is: 1. A bonding material comprising: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic material having 1-8 carbon atoms; a flux component of oxydiacetic acid; and a dispersion medium. 2. The bonding material according to claim 1 , comprising silver particles having an average particle diameter of 0.5 μm or larger and 3.0 μm or smaller. 3. The bonding material according to claim 1 , wherein the number of carbon atoms of the organic material is 6. 4. The bonding material according to claim 1 , wherein the dispersion medium is a polar solvent.
Assignees
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Classifications
between stacked chips · CPC title
of die-attach connectors · CPC title
Controlling the bonding environment, e.g. atmosphere composition or temperature · CPC title
Soldering or alloying · CPC title
Compression bonding, e.g. thermocompression bonding · CPC title
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- What does patent US9240256B2 cover?
- A method of forming a bonded product using metal nanoparticles is provided. More specifically, provided is a paste containing a flux component that can form a metal phase even in an inert atmosphere. The use of this paste allows a bonding material that can give a practically acceptable bonding strength to be provided in an inert atmosphere such as a nitrogen atmosphere at low temperatures witho…
- Who is the assignee on this patent?
- Endoh Keiichi, Hisaeda Yutaka, Miyazawa Akihiro, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification H01B1/02. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 19 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).