Bonding method using bonding material
US-10090275-B2 · Oct 2, 2018 · US
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Hisaeda Yutaka patents
Hisaeda Yutaka is listed as an inventor on 4 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hisaeda Yutaka |
| Total patents | 4 |
| First publication | Aug 27, 2015 |
| Latest publication | Oct 2, 2018 |
Notable patents
Publications ranked by popularity score, then publication date.
Bonding material and bonding method using the same
US-10008471-B2 · Jun 26, 2018 · US
Fine silver particle powder, method for manufacturing the same, silver paste using the powder and method of use of the paste
US-9721694-B2 · Aug 1, 2017 · US
Fine silver particle powder, method for manufacturing the same, silver paste using the powder and method of use of the paste
US-2015243400-A1 · Aug 27, 2015 · US
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Dowa Electronics Materials Co Ltd | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.