Bonding material and bonding method using the same
US-2016172328-A1 · Jun 16, 2016 · US
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Nagahara Aiko patents
Nagahara Aiko is listed as an inventor on 3 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Nagahara Aiko |
| Total patents | 3 |
| First publication | Jan 19, 2016 |
| Latest publication | Jun 16, 2016 |
Notable patents
Publications ranked by popularity score, then publication date.
Bonding material and bonding method using the same
US-2016099087-A1 · Apr 7, 2016 · US
Bonding material and bonding method using the same
US-9240256-B2 · Jan 19, 2016 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Dowa Electronics Materials Co Ltd | 3 |
| Endoh Keiichi | 1 |
| Hisaeda Yutaka | 1 |
| Miyazawa Akihiro | 1 |
| Nagahara Aiko | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/732 | 3 |
| H10W90/731 | 3 |
| H10W72/07341 | 3 |
| H10W72/07336 | 3 |
| H10W72/07332 | 3 |