Electronic apparatus and method for fabricating the same
US-2016247776-A1 · Aug 25, 2016 · US
Pb-free solder paste
US9227273B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9227273-B2 |
| Application number | US-201114003335-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 18, 2011 |
| Priority date | Mar 8, 2011 |
| Publication date | Jan 5, 2016 |
| Grant date | Jan 5, 2016 |
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Abstract
Official abstract text for this publication.
There is provided a high-temperature Pb-free solder paste having the strength required to join electronic parts to a substrate and having excellence in wettability and workability. The solder paste formed by mixing a solder alloy and a flux, the solder alloy consisting of, based on the total mass of the solder alloy as 100 mass %: 0.4 to 13.5 mass % of Zn, at least one of 0.01 to 2.0 mass % of Cu or 0.03 to 0.7 mass % of Al, and a balance being Bi except for inevitable impurities.
First claim
Opening claim text (preview).
The invention claimed is: 1. A Pb-free solder paste formed by mixing a solder alloy powder and a flux, the solder alloy consisting of, based on the total mass of the solder alloy powder as 100 mass %: 0.4 to 13.1 mass % of Zn, and 0.03 to 0.4 mass % of Al, and a balance being Bi except for inevitable impurities, and the flux consisting of, based on the total mass of the flux as 100 mass %: 20 to 30 mass % of rosin, 0.2 to 1 mass % of activator, and 70 to 80 mass % of solvent. 2. A Pb-free solder paste formed by mixing a solder alloy powder and a flux, the solder alloy powder consisting of, based on the total mass of the solder alloy powder as 100 mass %: 0.4 to 13.1 mass % of Zn, 0.01 to less than 2.0 mass % of Cu, 0.03 to 0.4 mass % of Al, and a balance being Bi except for inevitable impurities, and the flux consisting of, based on the total mass of the flux as 100 mass %: 20 to 30 mass % of rosin, 0.2 to 1 mass % of activator, and 70 to 80 mass % of solvent.
Assignees
Inventors
Classifications
- B23K35/264Primary
Bi as the principal constituent · CPC title
Alloys based on antimony or bismuth · CPC title
- B23K35/025Primary
Pastes, creams or slurries · CPC title
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- What does patent US9227273B2 cover?
- There is provided a high-temperature Pb-free solder paste having the strength required to join electronic parts to a substrate and having excellence in wettability and workability. The solder paste formed by mixing a solder alloy and a flux, the solder alloy consisting of, based on the total mass of the solder alloy as 100 mass %: 0.4 to 13.5 mass % of Zn, at least one of 0.01 to 2.0 mass…
- Who is the assignee on this patent?
- Iseki Takashi, Sumitomo Metal Mining Co
- What technology area does this patent fall under?
- Primary CPC classification B23K35/264. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jan 05 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).