Plating catalyst and method

Patent metadata

Field	Value
Publication number	US-9227182-B2
Application number	US-201213732271-A
Country	US
Kind code	B2
Filing date	Dec 31, 2012
Priority date	Dec 31, 2011
Publication date	Jan 5, 2016
Grant date	Jan 5, 2016

Abstract

A solution including a precious metal nanoparticle and a polymer polymerized from a monomer comprising at least a monomer having two or more carboxyl groups or carboxylic acid salt groups. The solution is useful for a catalyst for a process of electroless plating of a metal on non-conductive surface.

First claim

What is claimed is:

1. A solution comprising a precious metal nanoparticle and polyepoxysuccinic acid or salts thereof.

2. The solution of claim 1 , wherein the precious metal is silver, gold, platinum, palladium, rhodium, ruthenium, iridium or osmium.

3. A process for electroless plating a metal on non-conductive surface, the process comprises the steps of;
a) dipping a substrate to be plated into a solution comprising a precious metal nanoparticle and a polymer, the polymer is polymerized from a monomer comprising at least a monomer having two or more carboxyl groups or carboxylic acid salt groups; and
b) conducting electroless plating of the substrate without an accelerating step.

4. The process of claim 3 , wherein the polymer has an oxygen atom as an ether bond in a principal chain.

5. The process of claim 4 , wherein the polymer is polyepoxysuccinic acid or salts thereof.

6. The process of claim 3 , wherein the polymer is polymaleic acid or polymer polymerized by a maleic acid and another polymerizable monomer chosen from acrylic acid, methacrylic acid, phosphonic acid and sulfonic acid.

7. The process of claim 3 , wherein the polymer comprises monomers of acrylic acid and citraconic acid or phosphonic acid and citraconic acid.

8. The process of claim 3 , wherein the precious metal is silver, gold, platinum, palladium, rhodium, ruthenium, iridium or osmium.

Assignees

• Rohm & Haas Elect Mat

Inventors

• Zhou Wenjia
• Kwong Suk Kwan
• Chan Dennis Chit Yiu
• Yee Dennis Kwok Wai
• Zhou Weijuan

Classifications

• H05K2203/072

  Electroless plating, e.g. finish plating or initial plating · CPC title

• C23C18/208

  with use of metal first · CPC title

• C23C18/1844

  with use of organic or inorganic compounds other than metals, first · CPC title

• H05K2203/0307

  Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites · CPC title

• C23C18/40

  using reducing agents · CPC title