Cooling system for processing chamber
US-2024393018-A1 · Nov 28, 2024 · US
Electrostatic chuck having reduced arcing
US9218997B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9218997-B2 |
| Application number | US-27018708-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 13, 2008 |
| Priority date | Nov 6, 2008 |
| Publication date | Dec 22, 2015 |
| Grant date | Dec 22, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
Electrostatic chucks and methods of manufacturing the same are provided herein. In some embodiments, an electrostatic chuck comprises an electrically conductive body having one or more channels formed in an upper surface thereof; a plate positioned within the one or more channels to define one or more plenums between the body and the plate, wherein the surfaces of the plenum are anodized; one or more fluid passages disposed in the plate and fluidly coupling the one or more plenums to the upper surface of the body, wherein the surfaces of the fluid passages are electrically insulated; and a dielectric layer disposed over the upper surface of the body and the plate, wherein the dielectric layer forms a support surface for a substrate to be disposed thereon.
First claim
Opening claim text (preview).
The invention claimed is: 1. An electrostatic chuck for retaining a substrate, comprising: an electrically conductive body having one or more channels formed in an upper surface thereof; a single plate positioned within the one or more channels to define one or more plenums between the body and the plate, wherein the surfaces of the plenum are anodized, wherein the one or more channels further include an outer channel and an inner channel disposed proximate a peripheral edge of…
Assignees
Inventors
Classifications
Electricity · mapped topic
- H10P72/72Primary
Electricity · mapped topic
Electricity · mapped topic
- H01L21/6831Primary
Electricity · mapped topic
Cross-Sectional Technologies · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9218997B2 cover?
- Electrostatic chucks and methods of manufacturing the same are provided herein. In some embodiments, an electrostatic chuck comprises an electrically conductive body having one or more channels formed in an upper surface thereof; a plate positioned within the one or more channels to define one or more plenums between the body and the plate, wherein the surfaces of the plenum are anodized; one o…
- Who is the assignee on this patent?
- Jun Seok Yul, Park Bum Jin, Kim Sun Il, and 9 more
- What technology area does this patent fall under?
- Primary CPC classification H10P72/72. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 22 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).