Substrate correction device, substrate lamination device, substrate processing system, substrate correction method, substrate processing method, and semiconductor device manufacturing method
US-2024404859-A1 · Dec 5, 2024 · US
Low profile wire bonded USB device
US8947883B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8947883-B2 |
| Application number | US-96569107-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 27, 2007 |
| Priority date | Dec 27, 2007 |
| Publication date | Feb 3, 2015 |
| Grant date | Feb 3, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A low profile USB flash memory device, and methods of forming same, are disclosed. The USB flash memory device includes an integrated circuit memory portion and a USB connector. The memory portion and the USB connector may be integrally formed on the same substrate. The USB flash memory device includes a substrate on which is mounted one or more flash memory die, a controller die, passive components and an LED for indicating when the memory is being accessed. In contrast to prior art USB memory devices which used TSOP packages mounted on a printed circuit board, the semiconductor die of the present invention are affixed to the substrate and wire bonded in a SIP configuration. Omitting the encapsulated TSOP packages allows a reduction in the overall thickness of the USB flash memory device.
First claim
Opening claim text (preview).
We claim: 1. A USB flash memory device, comprising: a substrate; a conductance pattern defined on a surface of the substrate; USB connector pins formed in the conductance pattern on the substrate for removable insertion into a host device and for electrically coupling the USB flash memory device with the host device when inserted into the host device; one or more semiconductor die, the one or more semiconductor die including die bond pads on an upper surface of the one or mo…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10P95/00Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8947883B2 cover?
- A low profile USB flash memory device, and methods of forming same, are disclosed. The USB flash memory device includes an integrated circuit memory portion and a USB connector. The memory portion and the USB connector may be integrally formed on the same substrate. The USB flash memory device includes a substrate on which is mounted one or more flash memory die, a controller die, passive compo…
- Who is the assignee on this patent?
- Upadhyayula Suresh, Miller Robert C, Takiar Hem, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification H10P95/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).