Transistor contacts and methods of forming the same
US-2024395871-A1 · Nov 28, 2024 · US
US9214554B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9214554-B2 |
| Application number | US-201514607977-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 28, 2015 |
| Priority date | Jul 10, 2006 |
| Publication date | Dec 15, 2015 |
| Grant date | Dec 15, 2015 |
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A fin-FET or other multi-gate transistor is disclosed. The transistor comprises a semiconductor substrate having a first lattice constant, and a semiconductor fin extending from the semiconductor substrate. The fin has a second lattice constant, different from the first lattice constant, and a top surface and two opposed side surfaces. The transistor also includes a gate dielectric covering at least a portion of the top surface and the two opposed side surfaces, and a gate electrode covering at least a portion of the gate dielectric. The resulting channel has a strain induced therein by the lattice mismatch between the fin and the substrate. This strain can be tuned by selection of the respective materials.
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What is claimed is: 1. A device comprising: a semiconductor substrate having a first lattice constant; a semiconductor fin extending directly and continuously from a top surface of the semiconductor substrate, the having a second lattice constant, the second lattice constant being different from the first lattice constant, the fin having a bottom surface disposed directly on the top surface of the semiconductor substrate, an opposite top surface and two opposed side surfaces, wh…
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