Method of forming a semiconductor die

Patent metadata

Field	Value
Publication number	US-9165833-B2
Application number	US-68911710-A
Country	US
Kind code	B2
Filing date	Jan 18, 2010
Priority date	Jan 18, 2010
Publication date	Oct 20, 2015
Grant date	Oct 20, 2015

Abstract

In one embodiment, semiconductor die having non-rectangular shapes and die having various different shapes are formed and singulated from a semiconductor wafer.

First claim

The invention claimed is:

1. A method of forming a semiconductor die comprising:
providing a semiconductor wafer including a silicon bulk semiconductor substrate having a top surface and a bottom surface;
forming a plurality of semiconductor die on the top surface of the silicon bulk semiconductor substrate with at least one die of the plurality of semiconductor die having two substantially straight sides that intersect to form a first corner at a substantially right angle and forming one or more other corners of the semiconductor die having a different shape than the first corner;
forming a singulation region as a region of the semiconductor wafer that is between the semiconductor die; and
using a dry etch to form an opening through the silicon bulk semiconductor substrate to simultaneously singulate the plurality of semiconductor die and form the first corner and the one or more other corners.

2. The method of claim 1 wherein using the dry etch includes forming the singulation region to have a distance between adjacent semiconductor die of approximately 2 to 20 microns.

3. The method of claim 1 wherein forming the plurality of semiconductor die includes forming the semiconductor die having at least one protrusion along the periphery to have dimensions wherein at least one dimension has a plurality of values.

4. The method of claim 1 wherein forming the plurality of semiconductor die includes forming the semiconductor die to have different areas.

5. The method of claim 1 wherein forming the singulation region includes forming the singulation region as a non-axial singulation line.

6. The method of claim 1 wherein forming the plurality of semiconductor die includes forming at least one of the one or more other corners with a curved shape.

7. The method of claim 1 wherein forming the plurality of semiconductor die includes forming at least one of the one or more other corners with a diagonal connecting the two straight sides.

Assignees

• Grivna Gordon M
• Seddon Michael J
• Semiconductor Components Ind

Inventors

• Grivna Gordon M
• Seddon Michael J

Classifications

• H10P58/00

  Singulating wafers or substrates into multiple chips, i.e. dicing · CPC title

• H10P54/00 Primary

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10P50/244 Primary

  comprising alternated and repeated etching and passivation steps · CPC title

• H10P50/242

  of Group IV materials · CPC title

• H10P50/73

  using masks for insulating materials · CPC title