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Printed circuit board and method for manufacturing the same
US9161460B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9161460-B2 |
| Application number | US-201113308439-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 30, 2011 |
| Priority date | Dec 29, 2010 |
| Publication date | Oct 13, 2015 |
| Grant date | Oct 13, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate having a metal pattern for a circuit; and a surface roughness provided on the metal pattern, wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a black oxide layer in a needle structure formed on the first surface roughness.
First claim
Opening claim text (preview).
What is claimed is: 1. A printed circuit board (PCB), comprising: a base substrate comprising a metal pattern for a circuit; and a surface roughness provided on the metal pattern, wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a black oxide layer in a needle structure formed on the first surface roughness, wherein the anchor structure has a neck portion and a head portion having larger surface area than the neck portion, and wherein a bismaleimide-triazine resin layer is formed on the black oxide layer in the needle structure, which is formed on the anchor structure, and wherein an interlayer adhesion between the metal pattern and the bismaleimide-triazine resin layer is more than 0.4 kgf/cm. 2. The PCB as set forth in claim 1 , wherein the second surface roughness further includes a reduction layer formed by reducing a surface of the black oxide layer. 3. The PCB as set forth in claim 1 , wherein the black oxide layer has a thickness of 0.05 to 1.0 mg/cm 2 . 4. The PCB as set forth in claim 1 , wherein a metal of the metal pattern for a circuit comprises Cu or a Cu alloy. 5. The PCB of claim 1 , wherein the anchor structure is uniformly formed over an entire length of the metal pattern.
Assignees
Inventors
Classifications
Printed elements for providing electric connections to or between printed circuits · CPC title
Details of three-dimensional rigid printed circuit boards (H05K1/119 takes precedence; shaping of the substrate H05K3/0014) · CPC title
by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer · CPC title
- H05K3/383Primary
by microetching · CPC title
- H05K3/462Primary
characterized by laminating only or mainly similar double-sided circuit boards · CPC title
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Frequently asked questions
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- What does patent US9161460B2 cover?
- Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate having a metal pattern for a circuit; and a surface roughness provided on the metal pattern, wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a black oxide layer in a needle structure fo…
- Who is the assignee on this patent?
- Ha Hyung Gi, Jung Jae Won, Kim Yong Hwan, and 6 more
- What technology area does this patent fall under?
- Primary CPC classification H05K3/383. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 13 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).