Back grinding apparatus and wear amount measuring method using the same
US-2024424637-A1 · Dec 26, 2024 · US
Thin wafer carrier
US9159595B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9159595-B2 |
| Application number | US-201113022215-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 7, 2011 |
| Priority date | Feb 9, 2010 |
| Publication date | Oct 13, 2015 |
| Grant date | Oct 13, 2015 |
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Abstract
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An improved wafer carrier device for carrying and holding semiconductor wafers that have a thickness of below 100 micrometers includes a transportable wafer chuck having an enclosed vacuum reservoir and a top surface configured to support a wafer. The top surface has one or more through-openings extending from the top surface to the vacuum reservoir and the wafer is held onto the top surface via vacuum from the vacuum reservoir drawn through the through-openings.
First claim
Opening claim text (preview).
What is claimed is: 1. A transportable wafer carrier device comprising: a wafer chuck comprising a top component and a bottom component and wherein said top component comprises a top surface and bottom surface and wherein said bottom component comprises an enclosed vacuum reservoir and is in contact with the bottom surface of the top component, and wherein the top surface of the component is configured to support a wafer so that a wafer surface comprising three-dimensional structu…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US9159595B2 cover?
- An improved wafer carrier device for carrying and holding semiconductor wafers that have a thickness of below 100 micrometers includes a transportable wafer chuck having an enclosed vacuum reservoir and a top surface configured to support a wafer. The top surface has one or more through-openings extending from the top surface to the vacuum reservoir and the wafer is held onto the top surface vi…
- Who is the assignee on this patent?
- Hurley Daniel T, George Gregory, Suss Microtec Lithography Gmbh
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0428. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 13 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).