Wafer processing method
US-2024395620-A1 · Nov 28, 2024 · US
Method of manufacturing a component comprising cutting a carrier
US9123764B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9123764-B2 |
| Application number | US-201213594711-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 24, 2012 |
| Priority date | Aug 24, 2012 |
| Publication date | Sep 1, 2015 |
| Grant date | Sep 1, 2015 |
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- Title
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Abstract
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A method of manufacturing a component is disclosed. An embodiment of the method comprises dicing a carrier in a plurality of components, the carrier being disposed on a support carrier, after dicing, placing a connection layer on the carrier and removing the components from the support carrier.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of manufacturing a semiconductor device, the method comprising: placing a wafer on a dicing foil; separating the wafer into chips, the chips are separated by spaces; after separating, placing a connection layer on the wafer; stretching the dicing foil thereby separating the connection layer; and picking up the chips from the dicing foil. 2. The method according to claim 1 , further comprising pre-curing the connection…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9123764B2 cover?
- A method of manufacturing a component is disclosed. An embodiment of the method comprises dicing a carrier in a plurality of components, the carrier being disposed on a support carrier, after dicing, placing a connection layer on the carrier and removing the components from the support carrier.
- Who is the assignee on this patent?
- Behrens Thomas, Mahler Joachim, Nikitin Ivan, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H10P72/7402. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 01 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).