Cooling system for processing chamber
US-2024393018-A1 · Nov 28, 2024 · US
Substrate support with symmetrical feed structure
US9123762B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9123762-B2 |
| Application number | US-91054710-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 22, 2010 |
| Priority date | Oct 22, 2010 |
| Publication date | Sep 1, 2015 |
| Grant date | Sep 1, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
Apparatus for processing a substrate is disclosed herein. In some embodiments, a substrate support may include a substrate support having a support surface for supporting a substrate the substrate support having a central axis; a first electrode disposed within the substrate support to provide RF power to a substrate when disposed on the support surface; an inner conductor coupled to the first electrode about a center of a surface of the first electrode opposing the support surface, wherein the inner conductor is tubular and extends from the first electrode parallel to and about the central axis in a direction away from the support surface of the substrate support; an outer conductor disposed about the inner conductor; and an outer dielectric layer disposed between the inner and outer conductors, the outer dielectric layer electrically isolating the outer conductor from the inner conductor. The outer conductor may be coupled to electrical ground.
First claim
Opening claim text (preview).
The invention claimed is: 1. A substrate support, comprising: a substrate support having a support surface for supporting a substrate, the substrate support having a central axis; and a symmetric electrical feed structure comprising: a first electrode disposed within the substrate support to provide RF power to a substrate when disposed on the support surface; an inner conductor coupled to the first electrode about a center of a surface of the first electrode opposing the su…
Assignees
Inventors
Classifications
Electricity · mapped topic
- H10P72/72Primary
Electricity · mapped topic
Electricity · mapped topic
- H01J37/32577Primary
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9123762B2 cover?
- Apparatus for processing a substrate is disclosed herein. In some embodiments, a substrate support may include a substrate support having a support surface for supporting a substrate the substrate support having a central axis; a first electrode disposed within the substrate support to provide RF power to a substrate when disposed on the support surface; an inner conductor coupled to the first …
- Who is the assignee on this patent?
- Lin Xing, Buchberger Jr Douglas A, Zhou Xiaoping, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification H10P72/72. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 01 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).