Power module and electrical device
US-2024235414-A1 · Jul 11, 2024 · US
Leadframe system with warp control mechanism and method of manufacture thereof
US9123712B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-9123712-B1 |
| Application number | US-201313949432-A |
| Country | US |
| Kind code | B1 |
| Filing date | Jul 24, 2013 |
| Priority date | Jul 24, 2013 |
| Publication date | Sep 1, 2015 |
| Grant date | Sep 1, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A leadframe system and method of manufacture includes: providing a leadframe having a side rail and a stabilizer, the side rail along a leadframe perimeter and the stabilizer within a rail inner perimeter of the side rail; forming a stabilizer plating layer directly on a bottom side of the stabilizer; and forming an encapsulation surrounded by a mold step, the mold step directly over the stabilizer and the stabilizer plating layer for forming a stiffening structure positioned within the rail inner perimeter of the side rail.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of manufacture of a leadframe system comprising: providing a leadframe having a side rail and a stabilizer, the side rail along a leadframe perimeter and the stabilizer within a rail inner perimeter of the side rail; forming a stabilizer plating layer directly on a bottom side of the stabilizer; and forming an encapsulation having a mold step surrounding a protruding portion of the encapsulation and the mold step directly over the stabilizer for…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9123712B1 cover?
- A leadframe system and method of manufacture includes: providing a leadframe having a side rail and a stabilizer, the side rail along a leadframe perimeter and the stabilizer within a rail inner perimeter of the side rail; forming a stabilizer plating layer directly on a bottom side of the stabilizer; and forming an encapsulation surrounded by a mold step, the mold step directly over the stabil…
- Who is the assignee on this patent?
- Do Byung Tai, Arnel Senosa Trasporto, Chua Linda Pei Ee, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H10W70/438. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 01 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).