Semiconductor device and method of forming Fo-WLCSP with recessed interconnect area in peripheral region of semiconductor die
US-10388584-B2 · Aug 20, 2019 · US
Do Byung Tai patents
Do Byung Tai holds 39 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 39 |
| Recent patents | 0 |
| First publication | Jan 20, 2015 |
| Latest publication | Aug 20, 2019 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Package-on-package using through-hole via die on saw streets
US-9847253-B2 · Dec 19, 2017 · US
Integrated circuit packaging system with a grid array with a leadframe and method of manufacture thereof
US-9799589-B2 · Oct 24, 2017 · US
Integrated circuit packaging system with unplated leadframe and method of manufacture thereof
US-9620480-B1 · Apr 11, 2017 · US
Integrated circuit packaging system with routable trace and method of manufacture thereof
US-9576873-B2 · Feb 21, 2017 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Semiconductor device and method of forming Fo-WLCSP with recessed interconnect area in peripheral region of semiconductor die
US-10388584-B2 · Aug 20, 2019 · US
Package-on-package using through-hole via die on saw streets
US-9847253-B2 · Dec 19, 2017 · US
Integrated circuit packaging system with a grid array with a leadframe and method of manufacture thereof
US-9799589-B2 · Oct 24, 2017 · US
Integrated circuit packaging system with unplated leadframe and method of manufacture thereof
US-9620480-B1 · Apr 11, 2017 · US
Integrated circuit packaging system with routable trace and method of manufacture thereof
US-9576873-B2 · Feb 21, 2017 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W74/00 | 33 |
| H10W72/884 | 30 |
| H01L2924/00 | 23 |
| H10W90/00 | 21 |
| H10W74/117 | 21 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 39 |
| Cross-Sectional Technologies | 1 |
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Frequently asked questions
Answers are generated from the same data shown on this page.
- How many patents does Do Byung Tai have in patentsdb?
- Do Byung Tai is linked to 39 publications as assignee in our database.
- What technology areas does Do Byung Tai patent most?
- Top mapped technology areas by patent count: Electricity (39); Cross-Sectional Technologies (1).
- Is Do Byung Tai's patent activity growing?
- In our data, assignee counts were 4 in 2017 and 1 in 2019 (lower year over year).
- What are recent patents assigned to Do Byung Tai?
- See the “Recent patents” section above for the latest 5 publications we attribute to this assignee.