Method for fabricating a semiconductor device

US9105575B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9105575-B2
Application numberUS-201313972793-A
CountryUS
Kind codeB2
Filing dateAug 21, 2013
Priority dateApr 10, 2013
Publication dateAug 11, 2015
Grant dateAug 11, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for fabricating a semiconductor device includes: forming first lines having a hydrophobic surface extending parallel to each other in a direction between first insulation layers having a hydrophilic surface; self-aligning hydrophilic particles over the first insulation layers to expose portions of the first lines at predetermined intervals; forming a plurality of variable resistance elements over the exposed portions of the first lines; and removing the particles.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for fabricating a semiconductor device, the method comprising: forming first lines having a hydrophobic surface extending parallel to each other in a direction between first insulation layers having a hydrophilic surface; self-aligning first hydrophilic particles over the first insulation layers to expose portions the first lines at predetermined intervals; forming a first material layer over the exposed portions of the first lines; and removi…

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What does patent US9105575B2 cover?
A method for fabricating a semiconductor device includes: forming first lines having a hydrophobic surface extending parallel to each other in a direction between first insulation layers having a hydrophilic surface; self-aligning hydrophilic particles over the first insulation layers to expose portions of the first lines at predetermined intervals; forming a plurality of variable resistance el…
Who is the assignee on this patent?
Sk Hynix Inc
What technology area does this patent fall under?
Primary CPC classification H01L27/2463. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).