Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Bonding structures and methods of forming the same
US9105485B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9105485-B2 |
| Application number | US-201313789942-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 8, 2013 |
| Priority date | Mar 8, 2013 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A package includes a package component and a second package component. A first elongated bond pad is at a surface of the first package component, wherein the first elongated bond pad has a first length in a first longitudinal direction, and a first width smaller than the first length. A second elongated bond pad is at a surface of the second package component. The second elongated bond pad is bonded to the first elongated bond pad. The second elongated bond pad has a second length in a second longitudinal direction, and a second width smaller than the second width. The second longitudinal direction is un-parallel to the first longitudinal direction.
First claim
Opening claim text (preview).
What is claimed is: 1. A package comprising: a first package component; a first elongated bond pad at a surface of the first package component, wherein the first elongated bond pad has a first length in a first longitudinal direction, and a first width smaller than the first length; a second package component; and a second elongated bond pad at a surface of the second package component and bonded to the first elongated bond pad, wherein the second elongated bond pad has a se…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9105485B2 cover?
- A package includes a package component and a second package component. A first elongated bond pad is at a surface of the first package component, wherein the first elongated bond pad has a first length in a first longitudinal direction, and a first width smaller than the first length. A second elongated bond pad is at a surface of the second package component. The second elongated bond pad is b…
- Who is the assignee on this patent?
- Taiwan Semiconductor Mfg
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).