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Automated process control using an adjusted metrology output signal
US9103664B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9103664-B2 |
| Application number | US-75291610-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 1, 2010 |
| Priority date | Apr 1, 2010 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
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Abstract
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Provided is a method for controlling a fabrication cluster using an optical metrology system that includes an optical metrology tool, an optical metrology model, and a profile extraction algorithm. The method comprises: selecting a number of rays for the illumination beam, selecting beam propagation parameters, using a processor, determining beam propagation parameters from the light source of the to the sample structure, determining the beam propagation parameters from the sample structure to the detector, calculating intensity and polarization of each ray on the detector, generating a total intensity and polarization of the diffraction beam, calculating a metrology output signal from the total intensity and polarization, extracting the one or more profile parameters using the metrology output signal, transmitting at least one profile parameter to a fabrication cluster, and adjusting at least one process parameter or equipment setting of the fabrication cluster.
First claim
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What is claimed: 1. A method for controlling a fabrication cluster using an optical metrology system, the optical metrology system including an optical metrology tool, an optical metrology model, and a profile extraction algorithm, the optical metrology model including a model of the optical metrology tool and a profile model of the sample structure, the profile model having sample profile parameters, the optical metrology tool having a light source, an illumination beam, optical e…
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Frequently asked questions
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- What does patent US9103664B2 cover?
- Provided is a method for controlling a fabrication cluster using an optical metrology system that includes an optical metrology tool, an optical metrology model, and a profile extraction algorithm. The method comprises: selecting a number of rays for the illumination beam, selecting beam propagation parameters, using a processor, determining beam propagation parameters from the light source of …
- Who is the assignee on this patent?
- Li Shifang, Madriaga Manuel, Tokyo Electron Ltd
- What technology area does this patent fall under?
- Primary CPC classification G01B11/24. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).