3DIC packages with heat sinks attached to heat dissipating rings

Patent metadata

Field	Value
Publication number	US-9076754-B2
Application number	US-201314144691-A
Country	US
Kind code	B2
Filing date	Dec 31, 2013
Priority date	Aug 2, 2013
Publication date	Jul 7, 2015
Grant date	Jul 7, 2015

Abstract

A package includes a first die and a second die underlying the first die and in a same first die stack as the first die. The second die includes a first portion overlapped by the first die, and a second portion extending beyond edges of the first die. A first Thermal Interface Material (TIM) is overlying and contacting a top surface of the first die. A heat sink has a first bottom surface over and contacting the first TIM. A second TIM is overlying and contacting the second portion of the second die. A heat dissipating ring is overlying and contacting the second TIM.

First claim

What is claimed is:

1. A package comprising:
a first die;
a second die underlying the first die and in a same first die stack as the first die, wherein the second die comprises:
a first portion overlapped by the first die; and
a second portion extending beyond edges of the first die;

a first Thermal Interface Material (TIM) over and contacting a top surface of the first die;
a heat sink comprising a first bottom surface over and contacting the first TIM;
a second TIM over and contacting the second portion of the second die; and
a heat dissipating ring over and contacting the second TIM.

2. The package of claim 1 , wherein the heat sink comprises a plurality of fins at a top surface of the heat sink, with a plurality trenches between the plurality of fins.

3. The package of claim 1 , wherein an entirety of bottom surfaces of the heat sink is planar.

4. The package of claim 1 , wherein the heat sink comprises:
a first bottom surface overlapping the heat dissipating ring; and
a second bottom surface below the first bottom surface.

5. The package of claim 1 , wherein the heat sink comprises a recess extending from a bottom surface of the heat sink to an intermediate level of the heat sink.

6. The package of claim 1 , wherein the second TIM forms a ring encircling the second die.

7. The package of claim 1 , wherein the first die stack further comprises a third die between the first die and the second die.

8. The package of claim 1 further comprising:
a third die;
a fourth die underlying the third die and in a same second die stack as the third die, wherein the fourth die comprises:
a first portion overlapped by the third die; and
a second portion not overlapped by the third die;

a third TIM over and contacting a top surface of the third die, wherein a top surface of the third TIM is in contact with a second bottom surface of the heat sink; and
a fourth TIM over and contacting the second portion of the fourth die, wherein the fourth TIM comprises a top surface in contact with the heat dissipating ring.

9. A package comprising:
a die stack comprising a plurality of dies;
a die underlying and bonded to the die stack, wherein the die comprises:
a first portion overlapped by the die stack; and
a second portion;

a first Thermal Interface Material (TIM) over and contacting a top surface of the die stack;
a second TIM over and contacting the second portion of the die;
a heat sink comprising a plurality of fins at a top surface of the heat sink, wherein the heat sink comprises:
a first portion over and contacting the first TIM; and
a second portion; and

a heat dissipating ring comprising an extension portion, wherein the extension portion is overlapped by the second portion of the heat sink, and wherein the extension portion of the heat dissipating ring further comprises a first bottom surface contacting the second TIM.

10. The package of claim 9 , wherein the heat sink and the heat dissipating ring are discrete components physically separated from each other.

11. The package of claim 9 further comprising:
a package substrate underlying and bonded to the die;
an adhesive having a thermal conductivity lower than thermal conductivities of the first TIM and the second TIM, wherein the adhesive comprises:
a top surface contacting a second bottom surface of the extension portion of the heat dissipating ring; and
a bottom surface contacting the package substrate.

12. The package of claim 9 , wherein the second TIM forms a ring encircling the die stack.

13. The package of claim 9 , wherein an entirety of all bottom surfaces of the heat sink is planar.

14. The package of claim 9 , wherein the heat sink comprises:
a first bottom surface overlapping the heat dissipating ring; and
a second bottom surface below the first bottom surface, wherein the second bottom surface is a bottom surface of a protruding portion of the heat sink.

15. The package of claim 9 , wherein the heat sink comprises a recess extending from a bottom surface of the heat sink to an intermediate level of the heat sink.

16. A package comprising:
a die stack comprising a plurality of dies;
a die underlying and bonded to the die stack, wherein the die comprises:
a first portion overlapped by the die stack; and
a second portion extending beyond edges of the die stack;

a first Thermal Interface Material (TIM) over and contacting a top surface of the die stack;
a second TIM over and contacting the second portion of the die;
a heat sink comprising:
a first bottom surface contacting the first TIM; and
a second bottom surface overlapping the second TIM; and

a heat dissipating ring comprising a first portion overlapping and contacting the second TIM, wherein the first portion of the heat dissipating ring encircles the die stack.

17. The package of claim 16 further comprising:
a package substrate, wherein the die is over and bonded to the package substrate;
a System-on-Chip (SoC) die over and bonded to the package substrate; and
a third TIM between, and contacting, the SoC die and the heat sink.

18. The package of claim 16 , wherein the heat dissipating ring further comprises a second portion encircling the first portion, wherein the second portion comprises a bottom surface, and wherein the package further comprises an adhesive comprising a top surface contacting a bottom surface of the second portion of the heating dissipating ring.

19. The package of claim 18 further comprising a third TIM between and contacting the heat sink and the second portion of the heat dissipating ring.

20. The package of claim 16 , wherein the heat sink comprises a recess extending from a bottom surface to an intermediate level of the heat sink.

Assignees

• Taiwan Semiconductor Mfg

Inventors

• Hung Wensen
• Huang Szu-Po
• Chen Kim Hong
• Jeng Shin-Puu

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W76/60

  Seals · CPC title

• H10W76/153

  having interconnections in passages through the insulating or insulated base · CPC title