Semiconductor die, semiconductor package and substrate dicing method
US-2024421000-A1 · Dec 19, 2024 · US
Distorting donor wafer to corresponding distortion of host wafer
US9058974B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9058974-B2 |
| Application number | US-201313908510-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 3, 2013 |
| Priority date | Jun 3, 2013 |
| Publication date | Jun 16, 2015 |
| Grant date | Jun 16, 2015 |
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Abstract
Official abstract text for this publication.
Improving wafer-to-wafer bonding alignment. Determining planar distortions of the bonding surface of a host wafer. Mounting a donor wafer on a bonding chuck by a plurality of fixation points, the bonding chuck including multiple zones capable of movement relative to each other. Distorting the bonding surface of the donor wafer by moving the zones of the bonding chuck relative to each other to cause distortions of the bonding surface of the donor wafer such that the distortions of the donor wafer bonding surface correspond to the determined planar distortions of the host wafer bonding surface.
First claim
Opening claim text (preview).
What is claimed is: 1. A method comprising: determining planar distortions of the bonding surface of a host wafer; mounting a donor wafer on a bonding chuck by a plurality of fixation points, the bonding chuck comprising multiple zones capable of movement relative to each other; and distorting the bonding surface of the donor wafer by moving the zones of the bonding chuck relative to each other to cause distortions of the bonding surface of the donor wafer such that the distor…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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- What does patent US9058974B2 cover?
- Improving wafer-to-wafer bonding alignment. Determining planar distortions of the bonding surface of a host wafer. Mounting a donor wafer on a bonding chuck by a plurality of fixation points, the bonding chuck including multiple zones capable of movement relative to each other. Distorting the bonding surface of the donor wafer by moving the zones of the bonding chuck relative to each other to c…
- Who is the assignee on this patent?
- IBM
- What technology area does this patent fall under?
- Primary CPC classification H10W72/071. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jun 16 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).