Multifilament conductor and method for producing same

Patent metadata

Field	Value
Publication number	US-9024192-B2
Application number	US-201013392380-A
Country	US
Kind code	B2
Filing date	Aug 24, 2010
Priority date	Aug 26, 2009
Publication date	May 5, 2015
Grant date	May 5, 2015

Abstract

A ribbon-shaped substrate and at least one superconductive layer form a multifilament conductor in which the superconductive layer is divided into filaments. The ribbon-shaped substrate has a first direction parallel to the longitudinal direction thereof, and the at least one filament has a second direction parallel to the longitudinal direction thereof. The first and second directions form an angle not equal to zero. The filaments of the multifilament conductor can be configured on the front and back of the conductor and be electrically connected to each other such that a transposed conductor is created.

First claim

The invention claimed is:

1. A multifilament conductor comprising:
a ribbon-shaped substrate, having a first direction parallel to a longitudinal extent thereof; and
at least one superconducting layer formed on at least one surface of the ribbon-shaped substrate and subdivided into filaments, at least one filament having a second direction, parallel to a longitudinal extent thereof, forming an angle greater than zero with the first direction of the ribbon-shaped substrate,
wherein the angle between the first direction of the ribbon-shaped substrate and the second direction of the at least one filament is between 1 and 5 degrees.

2. The multifilament conductor as claimed in claim 1 , wherein the at least one filament is formed fully along the second direction without a length component parallel to the first direction.

3. The multifilament conductor as claimed in claim 2 ,
wherein the ribbon-shaped substrate has a first surface on a front side and a second surface, opposite the first surface, on a rear side, and
wherein the filaments include a first group, formed on the first surface in the second direction, and a second group, formed on the second surface, having a third direction parallel to a longitudinal direction of the filaments in the second group and different from the second direction of the filaments in the first group.

4. The multifilament conductor as claimed in claim 3 ,
wherein the ribbon-shaped substrate includes at least one layer formed on at least one side surface on at least one side face of the ribbon-shaped substrate, and
wherein at least one filament in the first group is electrically conductively connected to at least one filament of the second group by the at least one layer of the ribbon-shaped substrate.

5. The multifilament conductor as claimed in claim 4 , further comprising at least one electrical bridge, formed between at least two neighboring filaments on at least one of the first and second surfaces, each electrical bridge providing an electrical connection of the at least two neighboring filaments.

6. The multifilament conductor as claimed in claim 5 , wherein the at least one electrical bridge is arranged centrally on the at least one of the first and second surfaces, with a longitudinal direction of the bridge parallel to the first direction of the ribbon-shaped substrate.

7. The multifilament conductor as claimed in claim 6 , wherein the multifilament conductor comprises a layer stack formed of ribbon-shaped carrier material, at least one buffer layer, at least one high-temperature superconducting layer, and/or at least one stabilization layer.

8. The multifilament conductor as claimed in claim 7 ,
wherein the ribbon-shaped carrier material is a steel, and/or
wherein the at least one buffer layer includes at least one material from the group: Al, yttria, IBAD MgO, homo-epi MgO, LMO, and/or
wherein the at least one superconducting layer is formed of YBCO, and/or
wherein the at least one bridge and the at least one high-temperature superconducting layer are formed of YBCO, and/or
wherein the at least one stabilization layer and the at least one bridge are formed of copper or silver or a layer stack with at least one copper and/or at least one silver layer.

9. The multifilament conductor as claimed in claim 8 ,
wherein the ribbon-shaped carrier material has a thickness between 50 μm and 100 μm, and a width of substantially 10 mm, and/or
wherein the at least one buffer layer has a thickness of substantially 100 nm, and/or
wherein the at least one superconducting layer has a thickness of substantially 1 pm, and/or
wherein the at least one filament has a width of substantially 0.5 mm, and/or
wherein the at least one stabilization layer has a thickness of substantially 3 μm.

10. The multifilament conductor as claimed in claim 9 , wherein the filaments are transposed and have a transposition length of substantially 20 cm.

11. A method for producing a multifilament conductor, comprising:
forming first and second ribbon-shaped carrier materials, both having a first direction parallel to a longitudinal extent thereof, each having first and second sides on opposite faces, the first side of each of the first and second ribbon-shaped carrier materials having at least one superconducting layer applied thereto and a stabilization layer applied onto the at least one superconducting layer, the superconducting layers and the stabilization layers of each of the first and second ribbon-shaped carrier materials being subdivided into filaments with at least one filament of at least one superconducting layer having a second direction, parallel to a longitudinal extent thereof, forming an angle greater than zero with the first direction of the first and second ribbon-shaped carrier materials, and the stabilization layer of the first ribbon-shaped carrier material overlapping with the stabilization layer of the second ribbon-shaped carrier material at edges of the first and second ribbon-shaped carrier materials so that an electrical connection of the stabilization layers is established via the edges; and
congruently bringing the second sides of the first and second ribbon-shaped carrier materials into mechanical connection with each other,
wherein the angle between the first direction of the ribbon-shaped substrate and the second direction of the at least one filament is between 1 and 5 degrees.

12. The method as claimed in claim 11 , further comprising
applying the superconducting and stabilization layers by at least one of electrolysis, soldering, evaporation coating, sputtering and thermal decomposition of metal compounds in vapor phase, and/or
subdividing the superconducting and stabilization layers into the filaments by at least one of lasering and chemical etching of trenches respectively passing fully through the superconducting and stabilization layers.

13. The method as claimed in claim 12 ,
wherein the trenches are formed with a non-zero angle between the first direction of the ribbon-shaped substrate and the second direction of the at least one filament, and
further comprising electrically connecting the filaments on the first and second ribbon-shaped carrier materials via edges thereof to form spiral-shaped current paths.

14. The method as claimed in claim 11 , further comprising applying the superconducting and stabilization layers by at least one of printing, adhesive bonding, electrolysis, soldering, evaporation coating, sputtering and thermal decomposition of metal compounds in vapor phase to directly form a filament structure.

15. The method as claimed in one of claim 14 , wherein said bringing of the first and second ribbon-shaped carrier materials into mechanical connection includes separating the first and second ribbon-shaped carrier materials by at least one of a heat-resistant insulating interlayer and an air gap by one of
welding the first and second ribbon-shaped carrier materials,
folding a single ribbon-shaped carrier ribbon into the first and second ribbon-shaped carrier materials lying above one another, and
rolling a tube flat, prior to texturizing rolling of the first and second ribbon-shaped carrier materials.

Assignees

• NEUMüLLER HEINZ-WERNER
• Ries Günter
• Siemens Ag

Inventors

• NEUMüLLER HEINZ-WERNER
• Ries Günter

Classifications

• Y10T29/49117

  Conductor or circuit manufacturing · CPC title

• H01L39/2464

  Electricity · mapped topic

• H01L39/248

  Electricity · mapped topic

• H01L39/143 Primary

  Electricity · mapped topic

• H10N60/0661

  Processes performed after copper oxide formation, e.g. patterning · CPC title