Method for manufacturing superconducting wire, and superconducting wire

US9558873B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9558873-B2
Application numberUS-201214376325-A
CountryUS
Kind codeB2
Filing dateFeb 1, 2012
Priority dateFeb 1, 2012
Publication dateJan 31, 2017
Grant dateJan 31, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for manufacturing a superconducting wire material in which the superconducting current is not saturated even when a superconducting layer is made into a thick film, and a superconducting wire material. In the method a superconducting layer is formed on a metal substrate interposed by an intermediate layer, the method including heating the metal substrate up to the film-formation temperature of a superconducting film for forming the superconducting layer, forming a superconducting film having a film thickness of at least 10 nm and no more than 200 nm on the intermediate layer, and reducing the metal substrate temperature to a level below the film-formation temperature of the superconducting film, and the superconducting film-formation, including the heating, the film-formation, and the cooling, are performed a plurality of times.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for manufacturing a superconducting wire in which a superconducting layer is formed above a metallic substrate with an intermediate layer in between, the method comprising: heating the metallic substrate to a film deposition temperature of a superconducting thin film which forms the superconducting layer; depositing the superconducting thin film with a thickness of 10-50 nm on the intermediate layer; and cooling the metallic substrate temperature below the film deposition temperature of the superconducting thin film, wherein forming the superconducting thin film which includes the heating, the depositing, and the cooling is performed plural times. 2. The method for manufacturing the superconducting wire according to claim 1 , wherein a temperature of heating the metallic substrate in the heating is 700-900° C. 3. The method for manufacturing the superconducting wire according to claim 1 , wherein the superconducting thin film is formed by Metal Organic Chemical Vapor Deposition. 4. The method for manufacturing the superconducting wire according of claim 1 , wherein the superconducting layer becomes 0.5 μm to 5.0 μm by performing the forming of the superconducting thin film plural times. 5. The method for manufacturing the superconducting wire according to claim 1 , wherein the metallic substrate is non-oriented.

Assignees

Inventors

Classifications

  • Superconductive coils · CPC title

  • H01F6/06Primary

    Coils, e.g. winding, insulating, terminating or casing arrangements therefor · CPC title

  • Films or wires on bases or cores · CPC title

  • Electricity · mapped topic

  • Electricity · mapped topic

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What does patent US9558873B2 cover?
A method for manufacturing a superconducting wire material in which the superconducting current is not saturated even when a superconducting layer is made into a thick film, and a superconducting wire material. In the method a superconducting layer is formed on a metal substrate interposed by an intermediate layer, the method including heating the metal substrate up to the film-formation temper…
Who is the assignee on this patent?
Nakasaki Ryusuke, Nakai Akinobu, Watanabe Tomonori, and 4 more
What technology area does this patent fall under?
Primary CPC classification H01F6/06. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 31 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).