Multi-filament superconducting composites

Patent metadata

Field	Value
Publication number	US-9786415-B2
Application number	US-201313935033-A
Country	US
Kind code	B2
Filing date	Jul 3, 2013
Priority date	Jul 5, 2012
Publication date	Oct 10, 2017
Grant date	Oct 10, 2017

Abstract

A configuration and a method of constructing a high-temperature superconductor tape including a plurality superconducting filaments sandwiched between a substrate and an overlayer, and having a compliant material extending between the substrate and the overlayer and isolating each superconducting filament.

First claim

I claim:

1. A HTS tape structure comprising:
a substrate;
a superconducting layer supported on the substrate, having at least one gap therein, wherein the substrate has a top surface adjacent the superconducting layer that has a gap therein that coincides with and extends to each gap within the superconducting layer; and
an overlayer deposited on the superconducting layer and the substrate within the at least one gap of the superconducting layer and within each gap within the substrate top surface, wherein the overlayer comprises compliant material.

2. The HTS tape structure of claim 1 , wherein the compliant material comprises a material chosen from a group consisting of metals, alloys, metal-ceramic composites, and combinations thereof.

3. The HTS tape structure of claim 2 , wherein the compliant material comprises silver.

4. The HTS tape structure of claim 1 , wherein the compliant material comprises a resistivity that is at least about 1 mΩcm.

5. The HTS tape structure of claim 1 , wherein each gap within the superconducting layer is generally aligned along the length of the tape.

6. A superconductor structure comprising:
a plurality of superconducting filaments supported on a substrate and having a gap between each filament, wherein the substrate has a top surface adjacent the superconducting filaments that has a gap therein that coincides with and extends to each gap between each filament; and
an overlayer disposed atop the filaments and extending into each gap between each filament and each gap within the substrate top surface and contacting the substrate;
wherein the overlayer comprises compliant material.

7. The superconductor structure of claim 6 , wherein each gap between each filament has a width of less than 100 μm.

8. The superconductor structure of claim 6 , wherein each gap between each filament is substantially parallel to each other along the length of the tape.

9. The superconductor structure of claim 6 , wherein the resistivity of the compliant material is higher than 1 mΩcm.

10. The superconductor structure of claim 6 , wherein the compliant material comprises a material chosen from a group consisting of metals, alloys, metal-ceramic composites, and combinations thereof.

11. The superconductor structure of claim 6 , wherein the compliant material comprises silver.

12. The HTS tape structure of claim 1 , wherein each gap within the superconducting layer has a width of less than 100 μm.

13. The HTS tape structure of claim 1 , wherein the superconducting layer comprises a buffer layer, and wherein the buffer layer has each gap within the superconducting layer therein.

14. The superconductor structure of claim 6 , wherein each filament comprises a buffer layer.

15. The HTS tape structure of claim 1 , wherein each gap within the superconducting layer has a width of less than about 50 μm.

16. The HTS tape structure of claim 1 , wherein each gap within the superconducting layer has a width of less than about 20 μm.

17. The HTS tape structure of claim 1 , wherein each gap within the superconducting layer has a width of less than about 5 μm.

18. The superconductor structure of claim 6 , wherein each gap between each filament has a width of less than about 50 μm.

19. The superconductor structure of claim 6 , wherein each gap between each filament has a width of less than about 20 μm.

20. The superconductor structure of claim 6 , wherein each gap between each filament has a width of less than about 5 μm.

Assignees

• Univ Houston System

Inventors

• Selvamanickam Venkat

Classifications

• H01L39/2464

  Electricity · mapped topic

• H01L39/143

  Electricity · mapped topic

• H01B12/06 Primary

  Films or wires on bases or cores · CPC title

• H01B13/0036

  Details · CPC title

• H01L39/2467

  Electricity · mapped topic