Position-measuring device and system having a plurality of position-measuring devices
US-9200893-B2 · Dec 1, 2015 · US
Method for inspecting defects, inspected wafer or semiconductor device manufactured using the same, method for quality control of wafers or semiconductor devices and defect inspecting apparatus
US9019498B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9019498-B2 |
| Application number | US-201013510769-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 19, 2010 |
| Priority date | Nov 20, 2009 |
| Publication date | Apr 28, 2015 |
| Grant date | Apr 28, 2015 |
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- Title
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Abstract
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Light from a light source device is polarized through a polarizer and is caused to impinge obliquely onto an object to be inspected. The resulting scattered light is received by a CCD imaging device having an element for separating scattered polarized light disposed in a dark field. Component light intensities are worked out for an obtained P-polarized component image and an obtained S-polarized component image and a polarization direction is determined as a ratio of them. The component light intensities and the polarization directions are determined from images obtained by imaging of the light scattering entities in a state where static stress is not applied to the object to the inspected and in a state where static load is applied thereto so as to generate tensional stress on the side irradiated by light. The component light intensities and the polarization directions are compared with predetermined threshold values.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for inspecting defects in an object to be inspected by polarizing, with a polarizer, light of a wavelength that can penetrate into the object to be inspected and directing the polarized light onto a surface of the object to be inspected for irradiation thereof, thereby detecting light scattered by the object to be inspected in a state where static stress is not applied to the object to be inspected and in a state where static stress is applied theret…
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Classifications
Electricity · mapped topic
- H10P74/00Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- G01N21/9505Primary
Physics · mapped topic
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Frequently asked questions
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- What does patent US9019498B2 cover?
- Light from a light source device is polarized through a polarizer and is caused to impinge obliquely onto an object to be inspected. The resulting scattered light is received by a CCD imaging device having an element for separating scattered polarized light disposed in a dark field. Component light intensities are worked out for an obtained P-polarized component image and an obtained S-polarize…
- Who is the assignee on this patent?
- Sakai Kazufumi, Nonaka Kazuhiro, Yamaguchi Shinsuke, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H10P74/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Apr 28 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).