Wafer processing method
US-2024395620-A1 · Nov 28, 2024 · US
Method of manufacturing semiconductor device
US8993413B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8993413-B2 |
| Application number | US-201213708358-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 7, 2012 |
| Priority date | Feb 2, 2012 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A method of manufacturing a semiconductor device includes the steps of preparing a semiconductor wafer having a thick portion in an outer circumferential end portion and a thin portion in a central portion, attaching a support material to one surface of the semiconductor wafer, dividing the semiconductor wafer into the thick portion and the thin portion, and cutting the thin portion, after the division, while supporting the thin portion by the support material.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of manufacturing a semiconductor device, comprising the steps of: preparing a semiconductor wafer by removing material from a back surface located opposite to a main surface to form a thick portion in an outer circumferential end portion and a thin portion in a central portion; attaching a support material to said back surface of said semiconductor wafer across said thin portion and said thick portion with the support material extending across an…
Assignees
Inventors
Classifications
Electricity · mapped topic
- H10P72/7402Primary
Electricity · mapped topic
Electricity · mapped topic
- H10P90/12Primary
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8993413B2 cover?
- A method of manufacturing a semiconductor device includes the steps of preparing a semiconductor wafer having a thick portion in an outer circumferential end portion and a thin portion in a central portion, attaching a support material to one surface of the semiconductor wafer, dividing the semiconductor wafer into the thick portion and the thin portion, and cutting the thin portion, after the …
- Who is the assignee on this patent?
- Nakata Kazunari, Terasaki Yoshiaki, Mitsubishi Electric Corp
- What technology area does this patent fall under?
- Primary CPC classification H10P72/7402. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).