Semiconductor device and method of bonding different size semiconductor die at the wafer level

Patent metadata

Field	Value
Publication number	US-8993377-B2
Application number	US-201113231839-A
Country	US
Kind code	B2
Filing date	Sep 13, 2011
Priority date	Sep 29, 2010
Publication date	Mar 31, 2015
Grant date	Mar 31, 2015

Abstract

A semiconductor wafer has first and second opposing surfaces. A plurality of conductive vias is formed partially through the first surface of the semiconductor wafer. The semiconductor wafer is singulated into a plurality of first semiconductor die. The first semiconductor die are mounted to a carrier. A second semiconductor die is mounted to the first semiconductor die. A footprint of the second semiconductor die is larger than a footprint of the first semiconductor die. An encapsulant is deposited over the first and second semiconductor die and carrier. The carrier is removed. A portion of the second surface is removed to expose the conductive vias. An interconnect structure is formed over a surface of the first semiconductor die opposite the second semiconductor die. Alternatively, a first encapsulant is deposited over the first semiconductor die and carrier, and a second encapsulant is deposited over the second semiconductor die.

First claim

What is claimed:

1. A method of making a semiconductor device, comprising:
providing a semiconductor wafer including an active surface and a second surface opposite the active surface;
forming a plurality of conductive vias partially through the active surface of the semiconductor wafer;
singulating the semiconductor wafer to separate a first semiconductor die;
disposing a second semiconductor die over the first semiconductor die with the active surface oriented toward the s…

Assignees

• Koo Jun Mo
• Marimuthu Pandi C
• Yoon Seung Wook
• Shim Il Kwon
• Stats Chippac Ltd

Inventors

• Koo Jun Mo
• Marimuthu Pandi C
• Yoon Seung Wook
• Shim Il Kwon

Classifications

• H10W20/0245

  Electricity · mapped topic

• H10W74/00

  Electricity · mapped topic

• H10W90/297

  Electricity · mapped topic

• H10W90/752

  Electricity · mapped topic

• H10W72/884

  Electricity · mapped topic