Semiconductor device and method of forming interposer with opening to contain semiconductor die
US-11688612-B2 · Jun 27, 2023 · US
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Koo Jun Mo patents
Koo Jun Mo is listed as an inventor on 17 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Koo Jun Mo |
| Total patents | 17 |
| First publication | Mar 31, 2015 |
| Latest publication | Jun 27, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package
US-10242948-B2 · Mar 26, 2019 · US
Semiconductor Device and Method of Forming Interposer with Opening to Contain Semiconductor Die
US-2018108542-A1 · Apr 19, 2018 · US
Semiconductor device and method of forming interposer with opening to contain semiconductor die
US-9875911-B2 · Jan 23, 2018 · US
Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in Fo-WLCSP
US-9679824-B2 · Jun 13, 2017 · US
Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure
US-9620455-B2 · Apr 11, 2017 · US
Semiconductor Device and Method of Using Substrate Having Base and Conductive Posts to Form Vertical Interconnect Structure in Embedded Die Package
US-2017098610-A1 · Apr 6, 2017 · US
Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package
US-9559039-B2 · Jan 31, 2017 · US
Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect
US-9437538-B2 · Sep 6, 2016 · US
Semiconductor Device and Method of Forming Sacrificial Adhesive Over Contact Pads of Semiconductor Die
US-2016197022-A1 · Jul 7, 2016 · US
Recent patents
Latest publications not already listed above.
Semiconductor device and method of forming stepped interposer for stacking and electrically connecting semiconductor die
US-9337116-B2 · May 10, 2016 · US
Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die
US-9318441-B2 · Apr 19, 2016 · US
Semiconductor device and method of forming RDL using UV-cured conductive ink over wafer level package
US-9305854-B2 · Apr 5, 2016 · US
Semiconductor device and method of forming TSV interposer with semiconductor die and build-up interconnect structure on opposing surfaces of the interposer
US-9224647-B2 · Dec 29, 2015 · US
Semiconductor device with protective layer over exposed surfaces of semiconductor die
US-9142515-B2 · Sep 22, 2015 · US
Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure
US-8999760-B2 · Apr 7, 2015 · US
Semiconductor device and method of bonding different size semiconductor die at the wafer level
US-8993377-B2 · Mar 31, 2015 · US
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