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Substrate processing apparatus, method for processing substrate, and storage medium
US8992687B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8992687-B2 |
| Application number | US-201113218983-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 26, 2011 |
| Priority date | Jul 26, 2007 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
Processing gas is supplied from the central upper part of a processing chamber to a wafer on a mounting board, while the processing chamber is exhausted from processing gas exhaust passages at areas outside of the wafer. In addition, purge gas is supplied from purge gas supply passages to a buffer chamber formed between the peripheral part of a container main body and that of a cover body. The supplied flow-rate of the processing gas is made less than the exhaust flow-rate in the processing gas exhaust passages. Accordingly, the purge gas in the buffer chamber is drawn into the processing chamber via a purge gas supply hole formed of a gap between the container main body and the cover body due to a negative pressure inside the processing chamber caused by a difference between the flow rates.
First claim
Opening claim text (preview).
What is claimed is: 1. A substrate processing apparatus comprising: a container main body that has a mounting board for a substrate and an upper part that is open; a cover body that covers the container main body, wherein a peripheral part of the cover body is spaced apart from a peripheral part of the container main body to thereby form a gap between the peripheral part of the cover body and the peripheral part of the container main body, thereby forming a non-hermetically seal…
Assignees
Inventors
Classifications
- H10P72/0402Primary
Electricity · mapped topic
Electricity · mapped topic
- H10P14/20Primary
Electricity · mapped topic
- H01L21/67017Primary
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8992687B2 cover?
- Processing gas is supplied from the central upper part of a processing chamber to a wafer on a mounting board, while the processing chamber is exhausted from processing gas exhaust passages at areas outside of the wafer. In addition, purge gas is supplied from purge gas supply passages to a buffer chamber formed between the peripheral part of a container main body and that of a cover body. The …
- Who is the assignee on this patent?
- Kudoh Hiroyuki, Mori Hideto, Okada Shinji, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0402. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).