Slurry supply system for CMP process

US8992287B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8992287-B2
Application numberUS-201113308706-A
CountryUS
Kind codeB2
Filing dateDec 1, 2011
Priority dateDec 1, 2011
Publication dateMar 31, 2015
Grant dateMar 31, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure relates to a slurry distribution system having a distribution tube connected between a mixing tank and a CMP tool. The mixing tank is configured to generate a polishing mixture comprising a diluted slurry having abrasive particles that enable mechanical polishing of a workpiece. The polishing mixture is transported between the mixing tank and a CMP tool by way of a transport piping. An energy source, in communication with the transport piping, transfers energy to the abrasive particles within the polishing mixture, thereby preventing accumulation of the abrasive particles within the transport piping.

First claim

Opening claim text (preview).

What is claimed is: 1. A slurry distribution system for a chemical mechanical polishing tool, comprising: a mixing tank configured to generate a polishing mixture comprising a diluted slurry mixture having abrasive particles that enable mechanical polishing of a workpiece; a transport piping configured to transport the polishing mixture between the mixing tank and a chemical mechanical polishing (CMP) tool, wherein the transport piping comprises a first tube and a second tube;…

Assignees

Inventors

Classifications

  • Operations & Transport · mapped topic

  • B24B57/02Primary

    Operations & Transport · mapped topic

  • Operations & Transport · mapped topic

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Frequently asked questions

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What does patent US8992287B2 cover?
The present disclosure relates to a slurry distribution system having a distribution tube connected between a mixing tank and a CMP tool. The mixing tank is configured to generate a polishing mixture comprising a diluted slurry having abrasive particles that enable mechanical polishing of a workpiece. The polishing mixture is transported between the mixing tank and a CMP tool by way of a transp…
Who is the assignee on this patent?
Wang Sheng-Chen, Wu Feng-Inn, Tsai Chih-Hung, and 3 more
What technology area does this patent fall under?
Primary CPC classification B24B57/02. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).