Localized CMP to improve wafer planarization
US-9418904-B2 · Aug 16, 2016 · US
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Wang Sheng-Chen patents
Wang Sheng-Chen holds 2 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 2 |
| Recent patents | 0 |
| First publication | Mar 31, 2015 |
| Latest publication | Aug 16, 2016 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Slurry supply system for CMP process
US-8992287-B2 · Mar 31, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Localized CMP to improve wafer planarization
US-9418904-B2 · Aug 16, 2016 · US
Slurry supply system for CMP process
US-8992287-B2 · Mar 31, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| B24C7/003 | 1 |
| B24B57/02 | 1 |
| B24B37/04 | 1 |
| H10P74/23 | 1 |
| H10P74/203 | 1 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Operations & Transport | 1 |
| Electricity | 1 |