Localized CMP to improve wafer planarization
US-9418904-B2 · Aug 16, 2016 · US
This page is not indexed by search engines while we improve data quality.
Wu Feng-Inn patents
Wu Feng-Inn holds 4 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 4 |
| Recent patents | 0 |
| First publication | Jan 27, 2015 |
| Latest publication | Aug 16, 2016 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Apparatus for CMP pad conditioning
US-9149906-B2 · Oct 6, 2015 · US
Slurry supply system for CMP process
US-8992287-B2 · Mar 31, 2015 · US
Systems providing an air zone for a chucking stage
US-8939815-B2 · Jan 27, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Localized CMP to improve wafer planarization
US-9418904-B2 · Aug 16, 2016 · US
Apparatus for CMP pad conditioning
US-9149906-B2 · Oct 6, 2015 · US
Slurry supply system for CMP process
US-8992287-B2 · Mar 31, 2015 · US
Systems providing an air zone for a chucking stage
US-8939815-B2 · Jan 27, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Operations & Transport | 3 |
| Electricity | 2 |