Composite structure and method
US-9205634-B2 · Dec 8, 2015 · US
Room temperature bonding machine and room temperature bonding method
US8985175B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8985175-B2 |
| Application number | US-81117708-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 29, 2008 |
| Priority date | Jan 9, 2008 |
| Publication date | Mar 24, 2015 |
| Grant date | Mar 24, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A room temperature bonding machine is provided with an evacuation apparatus, a gas supply apparatus, a pressure gauge, a cleaner apparatus, a pressure controller and a pressing mechanism. The evacuation apparatus evacuates gas from the chamber. The gas supply apparatus supplies introduction gas into the chamber. The pressure gauge measures the pressure in the chamber. The cleaner apparatus cleans first and second substrates in the chamber when said pressure is at a predetermined degree of vacuum. The pressure controller controls both of the evacuation apparatus and the gas supply apparatus so that the pressure is regulated to a target pressure. The pressing mechanism presses and bonds the first and second substrates when the pressure is set to said target pressure.
First claim
Opening claim text (preview).
The invention claimed is: 1. A room temperature bonding machine, comprising: an evacuation apparatus evacuating gas from a chamber; a gas supply apparatus supplying introduction gas into said chamber; a pressure gauge measuring a pressure in said chamber; a cleaner apparatus cleaning first and second substrates in said chamber when said pressure is at a predetermined degree of vacuum; a pressure controller controlling both of said evacuation apparatus and said gas supply a…
Assignees
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- B32B37/1009Primary
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US8985175B2 cover?
- A room temperature bonding machine is provided with an evacuation apparatus, a gas supply apparatus, a pressure gauge, a cleaner apparatus, a pressure controller and a pressing mechanism. The evacuation apparatus evacuates gas from the chamber. The gas supply apparatus supplies introduction gas into the chamber. The pressure gauge measures the pressure in the chamber. The cleaner apparatus clea…
- Who is the assignee on this patent?
- Kinouchi Masato, Goto Takayuki, Tawara Satoshi, and 5 more
- What technology area does this patent fall under?
- Primary CPC classification B32B37/1009. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Mar 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).