Semiconductor package having multiple substrates
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Lid design for reliability enhancement in flip chip package
US8976529B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8976529-B2 |
| Application number | US-201113007249-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 14, 2011 |
| Priority date | Jan 14, 2011 |
| Publication date | Mar 10, 2015 |
| Grant date | Mar 10, 2015 |
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Abstract
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In a package structure, a stiffener ring is over and bonded to a top surface of a first package component. A second package component is over and bonded to the top surface of the first package component, and is encircled by the stiffener ring. A metal lid is over and bonded to the stiffener ring. The metal lid has a through-opening.
First claim
Opening claim text (preview).
What is claimed is: 1. A package structure comprising: a first package component; a stiffener ring over and bonded to a top surface of the first package component; a second package component over and bonded to the top surface of the first package component, wherein the second package component is encircled by the stiffener ring; a metal lid over and bonded to the stiffener ring, wherein the metal lid comprises a plurality of openings, wherein the metal lid has a top-view sha…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8976529B2 cover?
- In a package structure, a stiffener ring is over and bonded to a top surface of a first package component. A second package component is over and bonded to the top surface of the first package component, and is encircled by the stiffener ring. A metal lid is over and bonded to the stiffener ring. The metal lid has a through-opening.
- Who is the assignee on this patent?
- Lin Wen-Yi, Lin Po-Yao, Lin Tsung-Shu, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification H10W76/40. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 10 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).