Cream solder and method of soldering electronic part

Patent metadata

Field	Value
Publication number	US-8968488-B2
Application number	US-30737007-A
Country	US
Kind code	B2
Filing date	Jul 3, 2007
Priority date	Jul 5, 2006
Publication date	Mar 3, 2015
Grant date	Mar 3, 2015

Abstract

A cream solder obtained by kneading an Sn—Ag—Cu alloy together with a flux, wherein the Sn—Ag—Cu alloy includes a mixture of a first powdery alloy and a second powdery alloy, the first powdery alloy is represented by an Sn—Ag phase diagram having a solid-liquid coexistence region and has a given silver amount which is larger than that in the eutectic composition (3.5 wt. % silver), and the second powdery alloy has a silver amount which is that in the eutectic composition (3.5 wt. % silver) or which is close to that in the eutectic composition and is smaller than that in the first powdery alloy. This cream solder has excellent strength and thermal stability, and satisfactory bonding properties. It is based on an inexpensive Sn—Ag—Cu solder alloy. It is suitable for use as a high-temperature-side lead-free solder material conformable to temperature gradation bonding. Also provided is a method of soldering.

First claim

The invention claimed is:

1. A solder cream for a dual-temperature solder connection, in which two steps of high and low temperature soldering are conducted in a reflow process, employing at least two kinds of solders having different reflow temperatures, the solder cream being obtained by kneading an Sn—Ag—Cu alloy with a flux,
the Sn—Ag—Cu alloy comprising a mixture of a first powder alloy for a high melting point and a second powder alloy for a low melting point,
the first powder alloy comprising,
10 to 30% by weight of Ag, and
2 to 20% by weight of Cu,
with a balance consisting of Sn and unavoidable impurities; and
the second powder alloy comprising smaller amounts, in percent by weight, of Ag and Cu than the first powder alloy, wherein the second powder alloy has a melting point lower than that of the first powder alloy, and
wherein the Sn—Ag—Cu alloy mixture comprises a total amount of Ag and Cu of not more than 35% by weight, and
the Sn—Ag—Cu alloy mixture after melting comprises a total amount of Ag of more than 10% by weight.

2. The solder cream according to claim 1 , wherein the first powder alloy is present in an amount of not less than 50% by weight of the mixture of the first and second powder alloys.

3. The solder cream according to claim 1 , wherein at least one of the first and second powder alloy comprises at least one of:
Ni, Fe, or Co, in an amount of not more than 1.0% by weight, or
Ge, in an amount of not more than 0.1% by weight.

4. The solder cream according to claim 1 , wherein the second powder alloy comprises:
between 0 to 4.0% by weight of Ag, and
between 0 to 2.0% by weight of Cu,
with a balance consisting of Sn and unavoidable impurities.

5. The solder cream according to claim 4 , wherein the first powder alloy is present in an amount of not less than 50% by weight of the mixture of the first and second powder alloys.

6. The solder cream according to claim 4 , wherein at least one of the first and second powder alloy comprises at least one of:
Ni, Fe, or Co, in an amount of not more than 1.0% by weight, or
Ge, in an amount of not more than 0.1% by weight.

7. A solder cream for a dual-temperature solder connection, in which two steps of high and low temperature soldering are conducted in a reflow process, employing at least two kinds of solders having different reflow temperatures, the solder cream being obtained by kneading an Sn—Ag—Cu alloy with a flux,
the Sn—Ag—Cu alloy comprising a mixture of a first powder alloy for a high melting point and a second powder alloy for a low melting point,
the first powder alloy comprising,
10 to 30% by weight of Ag, and
2 to 20% by weight of Cu,
with a balance consisting of Sn and unavoidable impurities; and
the second powder alloy comprising,
between 0 to 4.0% by weight of Ag,
between 0 to 2.0% by weight of Cu, and one of:
between 0 to 8% by weight of Sb,
between 0 to 10% by weight of In, and
between 0 to 10% by weight of Bi,
with a balance consisting of Sn and unavoidable impurities,
wherein, the Sn—Ag—Cu alloy mixture comprises a total amount of Ag and Cu of not more than 35% by weight, and
the Sn—Ag—Cu alloy mixture after melting comprises a total amount of Ag of more than 10% by weight.

8. A solder cream for a dual-temperature solder connection, in which two steps of high and low temperature soldering are conducted in a reflow process, employing at least two kinds of solders having different reflow temperatures, the solder cream being obtained by kneading an Sn—Ag—Cu alloy with a flux,
the Sn—Ag—Cu alloy comprising an alloy mixture of a first powder alloy for a high melting point, a second powder alloy for a low melting point, and a third powder,
the first powder alloy comprising,
10 to 30% by weight of Ag, and
2 to 20% by weight of Cu,
with a balance consisting of Sn and unavoidable impurities; and
the second powder alloy comprising,
between 0 to 4.0% by weight of Ag, and
between 0 to 4.0% by weight of Cu,
with a balance consisting of Sn and unavoidable impurities; and
the third powder comprising Cu,
wherein the Sn—Ag—Cu alloy mixture comprises a total amount of Ag and Cu of not more than 35% by weight,
the Cu is present in an amount of not more than 25% by weight of the total weight of the alloy mixture and the Cu powder, and
the Sn—Ag—Cu alloy mixture after melting comprises a total amount of Ag of more than 10% by weight.

Assignees

• Yamashita Mitsuo
• Goto Tomoaki
• Asagi Takeshi
• Fuji Electric Co Ltd
• Nihon Handa Co Ltd

Inventors

• Yamashita Mitsuo
• Goto Tomoaki
• Asagi Takeshi

Classifications

• B23K1/00

  Soldering, e.g. brazing, or unsoldering (B23K3/00 takes precedence) · CPC title

• H05K3/34

  by soldering · CPC title

• B23K35/26 Primary

  with the principal constituent melting at less than 400°C · CPC title

• C22C13/00

  Alloys based on tin · CPC title

• B23K1/0016 Primary

  Soldering of electronic components · CPC title